5M2210ZF256C5N Altera, 5M2210ZF256C5N Datasheet - Page 37

• Manufacturer Part Number: 5M2210ZF256C5N
• Description: ALTERA
• Manufacturer: Altera
• Series: MAX Vr

Specifications of 5M2210ZF256C5N

• Cpld Type: FLASH
• No. Of Macrocells: 1700
• No. Of I/o's: 271
• Propagation Delay: 7.5ns
• Global Clock Setup Time: 4.6ns
• Frequency: 201.1MHz
• Supply Voltage Range: 1.71V To 1.89V
• Programmable Type: In System Programmable
• Delay Time Tpd(1) Max: 7.0ns
• Voltage Supply - Internal: 1.71 V ~ 1.89 V
• Number Of Logic Elements/blocks: 2210
• Number Of Macrocells: 1700
• Number Of Gates: -
• Number Of I /o: 203
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 256-LBGA
• Rohs Compliant: Yes
• Lead Free Status / Rohs Status: Vendor undefined / RoHS Compliant

Chapter 2: MAX V Architecture
I/O Structure
December 2010 Altera Corporation
The 5M1270Z and 5M2210Z devices support four I/O banks, as shown in
Each of these banks support all of the LVTTL, LVCMOS, LVDS, and RSDS standards
shown in
PCI clamping diode on inputs and PCI drive compliance on outputs. You must use
Bank 3 for designs requiring PCI compliant I/O pins. The Quartus II software
automatically places I/O pins in this bank if assigned with the PCI I/O standard.
Figure 2–23. I/O Banks for 5M1270Z and 5M2210Z Devices
Notes to
(1)
(2)
(3) This I/O standard is not supported in Bank 1.
(4) Emulated LVDS output using a three resistor network (LVDS_E_3R).
(5) Emulated RSDS output using a three resistor network (RSDS_E_3R).
Each I/O bank has dedicated V
in that bank. A single device can support 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V interfaces;
each individual bank can support a different standard. Each I/O bank can support
multiple standards with the same V
V
both the input and output buffers in MAX V devices.
The JTAG pins for MAX V devices are dedicated pins that cannot be used as regular
I/O pins. The pins TMS, TDI, TDO, and TCK support all the I/O standards shown in
Table 2–4 on page 2–29
for all MAX V devices and their I/O standard support is controlled by the V
setting for Bank 1.
CCIO
Figure 2–23
Figure 2–23
I/O Bank 1
is 3.3 V, Bank 3 can support LVTTL, LVCMOS, and 3.3-V PCI. V
Figure
Table
2–23:
is a top view of the silicon die.
is a graphical representation only. Refer to the pin list and the Quartus II software for exact pin locations.
2–4. PCI compliant I/O is supported in Bank 3. Bank 3 supports the
except for PCI and 1.2-V LVCMOS. These pins reside in Bank 1
CCIO
All I/O Banks Support
3.3-V LVTTL/LVCMOS,
2.5-V LVTTL/LVCMOS,
1.8-V LVTTL/LVCMOS,
1.5-V LVCMOS,
1.2-V LVCMOS (3),
LVDS (4),
RSDS(5)
CCIO
pins that determine the voltage standard support
I/O Bank 2
I/O Bank 4
for input and output pins. For example, when
(Note
1),
(2)
MAX V Device Handbook
I/O Bank 3
CCIO
Also Supports
the 3.3-V PCI
I/O Standard
Figure
powers
CCIO
2–23.
2–31