BZV55-B12,115 NXP Semiconductors, BZV55-B12,115 Datasheet - Page 9

• Manufacturer Part Number: BZV55-B12,115
• Description: DIODE ZENER 12V 500MW SOD80C
• Manufacturer: NXP Semiconductors

Specifications of BZV55-B12,115

• Package / Case: LL-34, LLDS, MiniMELF, SOD80C
• Voltage - Zener (nom) (vz): 12V
• Voltage - Forward (vf) (max) @ If: 900mV @ 10mA
• Current - Reverse Leakage @ Vr: 100nA @ 8V
• Tolerance: ±2%
• Power - Max: 500mW
• Impedance (max) (zzt): 25 Ohm
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 200°C
• Zener Voltage: 12 V
• Voltage Tolerance: 2 %
• Voltage Temperature Coefficient: 8.4 mV / K
• Zener Current: 5 mA
• Power Dissipation: 500 mW
• Maximum Reverse Leakage Current: 0.1 uA
• Maximum Zener Impedance: 25 Ohms
• Maximum Operating Temperature: + 200 C
• Mounting Style: SMD/SMT
• Forward Voltage Drop: 0.9 V
• Minimum Operating Temperature: - 65 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 933827770115; BZV55-B12 T/R; BZV55-B12 T/R

NXP Semiconductors
10. Soldering
BZV55_SER
Product data sheet
Fig 7.
Fig 8.
2.90
Reflow soldering footprint SOD80C
1.70
Wave soldering footprint SOD80C
2.25
1.70
All information provided in this document is subject to legal disclaimers.
1.60
Rev. 5 — 26 January 2011
0.90
(2x)
6.30
4.90
2.70
1.90
4.55
4.30
2.30
sod080c
sod080c
BZV55 series
Voltage regulator diodes
Dimensions in mm
solder lands
solder resist
occupied area
Dimensions in mm
solder paste
© NXP B.V. 2011. All rights reserved.
solder lands
solder resist
occupied area
tracks
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