119790-8 TE Connectivity, 119790-8 Datasheet - Page 97

• Manufacturer Part Number: 119790-8
• Manufacturer: TE Connectivity
• Type: Card Edger

Specifications of 119790-8

• Number Of Contacts: 44POS
• Body Orientation: Straight
• Contact Plating: Gold
• Contact Material: Phosphor Bronze
• Termination Method: Solder
• Mounting Style: Through Hole
• Pitch (mm): 3.96mm
• Housing Material: Polyester
• Housing Color: Black
• Product Line: AMP PACE
• Product Type: Connector
• Connector Type: Connector Assembly
• Number Of Dual Positions: 22
• Housing Style: Closed End/Closed End - Standard
• Post Alignment: Clear Polyester Contact Tip Strip
• Proprietary Name: AMP PACE
• Termination Post Length (mm [in]): 4.57 [0.180]
• Centerline (mm [in]): 3.96 [0.156]
• Row Spacing (mm [in]): 5.08 [0.200]
• Pre-assembled: Yes
• Post Plating: Tin-Lead (30)
• Pcb Mount Retention Type: Compliant Posts
• Contact Plating, Mating Area, Material: Gold (30)
• Contact Base Material: Phosphor Bronze
• Underplate Material: Nickel
• Connector Style: Card Edge
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Lead Free Status / RoHS Status: Not Compliant

Catalog 1654080
Issued 7-03
www.tycoelectronics.com
The Reliable Plated Through-
Hole Interconnect
Solderless interconnections
have been popular in elec-
trical and electronic appli-
cation with world-wide
success for decades. They
provide reliable electrical
and mechanical stability
and offer applied-cost sav-
ings across the board. For
PC board applications,
ACTION PIN contacts from
Tyco Electronics provide
these features:
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Since ACTION PIN contacts
do not have to be soldered,
issues associated with sol-
der are eliminated, such as:
Large gas-tight contact
zone
Reliability due to stored
energy in compliant pin
contacts
No damage to plated
through-holes during
installation
Especially suited for mul-
tilayer PC boards
Less costly board manu-
facturing due to larger
hole tolerances com-
pared to use of solid
pins
Application can be
made by end-user
Repairability—contact
can be replaced in the
same pin location (two
repairs)
Installation with no heat
cycling of board
Permits mass insertion
by minimizing forces
needed to insert pins as
compared to solid pin
press-fit application
Significant applied-cost
savings in many applica-
tions
• Faulty solder joints
• Solder fumes; cont-
aminant’s are
deposited on the
contacts
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Solderless press-fit inter-
connections using the
ACTION PIN contact are
primarily integrated in, but
not limited to, backplanes.
Solderless press-fit inter-
connections are used in
racks, especially where
connectors must be fixed
on the solder side of the PC
board and/or component
side. In these applications,
the holes for ACTION PIN
contact connectors are cov-
ered during the soldering
process and press-fitting is
performed after soldering.
Other applications for
ACTION PIN contact
interconnections include PC
boards that incorporate
components using surface
mount technology (SMT).
Here, too, press-fit intercon-
nections can be applied
after soldering, thus elimi-
nating complications
associated with connectors
suitable for surface
mounting.
Card Edge Connectors
(Solder Type, Board-to-Board)
ACTION PIN Press-Fit Contacts
• Solder spots; short
• Flux residuals
• Thermal strain on
• Degasing of plated
circuits between
printed circuits
printed circuit
boards and
components
through-holes
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Cross-Section Area from Tyco Electronics ACTION PIN Press-Fit
Contact in Printed Circuit Board Holes from Tyco Electronics.
Note: ACTION PIN contact mounting hole specifications are presented in
each product section, where applicable.
Principle of the Tyco
Electronics Compliant
ACTION PIN Contact
When an ACTION PIN con-
tact is inserted into a plated
through-hole, two spring
members are compressed,
exerting force against the
hole for gas-tight connec-
tion. The diameter of the
hole is smaller than the
diagonal size of the pin
(see cross-section illustra-
tion below).
The beam characteristics of
the pin are designed so
that a plastic, as well as an
elastic, deformation takes
place during insertion. The
two spring members com-
press to different degrees
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
.037 [0.94]
Minimum
Hole Dia.
to accommodate hole toler-
ances. The compliant pin
also reduces strain on the
board. With a rigid pin, the
elastic strain energy is
stored entirely in the board,
leading to damage of the
plated through-holes. With
the ACTION PIN contact,
the residual force of the
elastic deformation main-
tains stored energy to pro-
duce a tight contact zone
between the pin and the
plated through-hole. This
provides long term electri-
cal and mechanical reliabili-
ty of the interconnection.
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
Maximum
Hole Dia.
.043 [1.09]
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