NTCS0805E3334HHT Vishay, NTCS0805E3334HHT Datasheet - Page 7

• Manufacturer Part Number: NTCS0805E3334HHT
• Description: NTC SMD 0805 NiSn 330K 3% High B T&R E3
• Manufacturer: Vishay
• Type: NTCr
• Series: NTCSr

Specifications of NTCS0805E3334HHT

• Description Of Terminals: Leadless
• Mounting Style: Surface Mount
• Pin Count: 2
• Screening Level: Automotive
• Sensitivity Index: 3930K
• Resistance @ 25c: 330kohm
• Thermal Time Constant: 10s
• Percentage Of Resistance Tolerance @ 25c: ±3
• Accuracy: ±1
• Operating Temperature Min Deg. C: -40C
• Operating Temperature Max Deg. C: 150C
• Product Length (mm): 2mm
• Product Height (mm): 0.8mm
• Product Depth (mm): 1.25mm
• Resistance: 330 KOhms
• Tolerance: 3 %
• Termination Style: SMD/SMT
• Operating Temperature Range: - 40 C to + 150 C
• Package / Case: 0805
• Dimensions: 0.8 mm H
• Lead Free Status / RoHS Status: Compliant
• Lead Free Status / RoHS Status: Compliant

NTCS0805E3.....T
Vishay BCcomponents
SOLDERING CONDITIONS
This SMD thermistor is only suitable for wave or reflow soldering, in accordance with JEDEC J-STD-020. The maximum
temperature of 260 °C during 40 s should not be exceeded.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
TESTS AND REQUIREMENTS
PACKAGING
TAPE SPECIFICATIONS
All tape specifications are in accordance with IEC 60286-3. Basic dimensions are given below. Carrier tape material is paper.
PAPER TAPE
www.vishay.com
22
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT
IEC 60068-2-58
300
250
200
150
100
50
0
6
D
0
0
≈ 245 °C
260 °C
215 °C
180 °C
130 °C
A
0
B
50
P
0
1
P
Reflow Soldering
TEST METHOD
2
2 K/s
P
0
100
T
C
Time (s)
150
For technical questions, contact:
10 s
10 s
F
E
JWB288
This datasheet is subject to change without notice.
40 s
1.3
1
Resistance to soldering heat
SMD 0805, Glass Protected
W
200
Solderability
Dimensions of the solder lands
NTC Thermistors
1.0
TEST
250
T
T
1
3.0
Notes
• Measured 0.3 mm above base pocket
• P
DIMENSIONS OF PAPER TAPE in millimeters
PARAMETER
A
B
W
E
F
D
P
P
P
T tape thickness
T
1
1
0
0
0
0
0
1
2
cover tape
pitch cumulative error over any 10 pitches ± 1.0 mm
[e-mail]
(1)
(1)
(2)
300
250
200
150
100
50
0
0
PROCEDURE
10 s at 260 °C
Lead (Pb)-free Reflow Soldering Profile
2 s at 235 °C
≈ 245 °C
≈ 170 °C
260 °C
235 °C
50
100
2 K/s
max.
≈ 120 °C
DIMENSION
150
Time (s)
< 0.1
2.35
1.75
1.55
Min. 95 % of surface wetted
1.7
8.0
3.5
4.0
4.0
2.0
1.1
200
www.vishay.com/doc?91000
REQUIREMENTS
Document Number: 29044
R/R < 5 %
250
20 s min.
40 s max.
Revision: 09-Mar-11
≈ 60 s
TOLERANCE
6 K/s
max.
limit
normal
300
± 0.05
± 0.05
± 0.05
± 0.2
± 0.1
± 0.2
± 0.1
± 0.1
± 0.1
Max.
-
350