MMBZ5222BLT1G ON Semiconductor, MMBZ5222BLT1G Datasheet - Page 2
![DIODE ZENER 2.5V 225MW SOT-23](/photos/1/38/13877/sot-23-3_to-236-3_micro3_ssd3_sst3_sml.jpg)
MMBZ5222BLT1G
Manufacturer Part Number
MMBZ5222BLT1G
Description
DIODE ZENER 2.5V 225MW SOT-23
Manufacturer
ON Semiconductor
Datasheet
1.MMBZ5227BLT1G.pdf
(6 pages)
Specifications of MMBZ5222BLT1G
Voltage - Zener (nom) (vz)
2.5V
Voltage - Forward (vf) (max) @ If
900mV @ 10mA
Current - Reverse Leakage @ Vr
100µA @ 1V
Power - Max
225mW
Impedance (max) (zzt)
30 Ohm
Mounting Type
Surface Mount
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Operating Temperature
-65°C ~ 150°C
Zener Voltage
2.5 V
Voltage Tolerance
5 %
Zener Current
10 mA
Power Dissipation
300 mW
Maximum Reverse Leakage Current
100 uA
Maximum Zener Impedance
30 Ohms
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 65 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Tolerance
-
Lead Free Status / Rohs Status
Details
Other names
MMBZ5222BLT1GOS
MMBZ5222BLT1GOS
MMBZ5222BLT1GOSTR
MMBZ5222BLT1GOS
MMBZ5222BLT1GOSTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MMBZ5222BLT1G
Manufacturer:
ON
Quantity:
30 000
Company:
Part Number:
MMBZ5222BLT1G
Manufacturer:
ON
Quantity:
30 000
Part Number:
MMBZ5222BLT1G
Manufacturer:
ON/安森美
Quantity:
20 000
Product Bulletin #16134
3.
Parts with a smooth bottom surface finish have been attributed with higher failure rates as compared to failure rates
of parts with a matte finish. A matte finish has more surface area for the glue to adhere to as compared to a part
with a smooth surface. As a containment action, ON Semiconductor has placed shipment holds on any inventories
of smooth parts and has notified some customers who have received smooth parts.
We also suspended manufacturing on mold systems that produce smooth parts to have those mold systems
enhanced to produce parts with a matte surface finish. These containment actions have temporarily affected our
capacity but have been resolved and we have returned to full capacity.
The enhanced matte surface is designed to overcome any variability of the mold compound and aids in a
containment action until we can eliminate that variability.
What to do next?
If you have consumed product starting from date code 0814 and have not experienced any component placement
issues on your boards, you should not be affected. Product reliability is not a concern as parts either solder
normally or they don’t.
If you have a manufacturing process that consists of gluing these components to the bottom side of a board in a
wave solder process and have experienced components falling off boards with a greater than normal frequency,
please contact your ON Semiconductor Customer Service Representative or Salesperson to facilitate product
replacement or contact a technical representative to further discuss the issue for containment or other actions.
For technical assistance, please contact:
Asia Pacific/Japan:
Stephen Ng
ON Semiconductor Quality
Phone: +852 26890209
Email:
United States:
Mark Wasilewski
ON Semiconductor Quality
Phone: 602-244-5114
Email:
Europe:
Herve Marchionini
ON Semiconductor Quality,
Phone: +49 89 930 808 36
Email:
Issue Date: 11 Jul 2008
Surface finish of parts
stephen.ng@onsemi.com
m.wasilewski@onsemi.com
herve.marchionini@onsemi.com
Rev.07-02-06
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