BZT52H-C30,115 NXP Semiconductors, BZT52H-C30,115 Datasheet - Page 9
![DIODE ZENER 30V 375MW SOD123F](/photos/5/25/52532/568-sod-123f_sml.jpg)
BZT52H-C30,115
Manufacturer Part Number
BZT52H-C30,115
Description
DIODE ZENER 30V 375MW SOD123F
Manufacturer
NXP Semiconductors
Datasheet
1.BZT52H-C10115.pdf
(13 pages)
Specifications of BZT52H-C30,115
Package / Case
SOD-123 Flat Leads
Voltage - Zener (nom) (vz)
30V
Voltage - Forward (vf) (max) @ If
900mV @ 10mA
Current - Reverse Leakage @ Vr
50nA @ 21V
Tolerance
±5%
Power - Max
375mW
Impedance (max) (zzt)
40 Ohm
Mounting Type
Surface Mount
Operating Temperature
-65°C ~ 150°C
Zener Voltage
30 V
Voltage Tolerance
5 %
Voltage Temperature Coefficient
26.9 mV / K
Power Dissipation
830 mW
Maximum Reverse Leakage Current
0.05 uA
Maximum Zener Impedance
40 Ohms
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 65 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-3765-2
934059414115
BZT52H-C30 T/R
934059414115
BZT52H-C30 T/R
NXP Semiconductors
11. Soldering
BZT52H_SER
Product data sheet
Fig 6.
2.1
Reflow soldering is the only recommended soldering method.
Dimensions in mm.
Reflow soldering footprint SOD123F
1.6
All information provided in this document is subject to legal disclaimers.
(2×)
1.1
Rev. 3 — 7 December 2010
4.4
2.9
1.6
4
Single Zener diodes in a SOD123F package
1.1 1.2
BZT52H series
© NXP B.V. 2010. All rights reserved.
solder lands
solder resist
solder paste
occupied area
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