NE3509M04-EVNF24 CEL, NE3509M04-EVNF24 Datasheet - Page 8

no-image

NE3509M04-EVNF24

Manufacturer Part Number
NE3509M04-EVNF24
Description
GPS Modules & Development Tools For NE3509M04-A
Manufacturer
CEL
Type
Evaluation Boardr
Datasheet

Specifications of NE3509M04-EVNF24

Processor Used
NE3509M04
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
RECOMMENDED SOLDERING CONDITIONS
methods and conditions other than those recommended below, contact your nearby sales office.
8
Infrared Reflow
Partial Heating
Caution Do not use different soldering methods together (except for partial heating).
This product should be soldered and mounted under the following recommended conditions.
Soldering Method
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
Data Sheet PG10608EJ01V0DS
Soldering Conditions
: 260°C or below
: 120±30 seconds
: 350°C or below
: 3 seconds or less
: 10 seconds or less
: 60 seconds or less
: 3 times
: 0.2%(Wt.) or below
: 0.2%(Wt.) or below
Condition Symbol
NE3509M04
HS350
IR260
For soldering

Related parts for NE3509M04-EVNF24