TGA4506 TriQuint, TGA4506 Datasheet - Page 11
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TGA4506
Manufacturer Part Number
TGA4506
Description
Wireless Accessories 20-27 GHz LNA
Manufacturer
TriQuint
Datasheet
1.TGA4506.pdf
(11 pages)
Specifications of TGA4506
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
1009169
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TGA4506
Manufacturer:
Triquint
Quantity:
1 400
Company:
Part Number:
TGA4506-EPU
Manufacturer:
AOS
Quantity:
16 500
Company:
Part Number:
TGA4506-SM
Manufacturer:
TRIQUINT
Quantity:
230
Proper ESD precautions must be followed while handling packages.
TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven
vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed
in the table below.
Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement.
The volume of solder paste depends on PCB and component layout and should be well controlled to
ensure consistent mechanical and electrical performance.
Solder attach process requires the use of no clean flux.
Time above Melting Point
Time within 5 °C of Peak
Max Peak Temperature
Activation Time and
Reflow Profile
Ramp-down Rate
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Ramp-up Rate
Temperature
Temperature
Recommended Surface Mount Package Assembly
TGA4506-SM
Part
Typical Solder Reflow Profiles
60 – 120 sec @ 140 – 160 °C
Ordering Information
Jan 2011 © Rev B
60 – 150 sec
4 – 6 °C/sec
10 – 20 sec
3 °C/sec
240 °C
SnPb
QFN 4x4 Surface Mount
Package Style
60 – 180 sec @ 150 – 200 °C
TGA4506-SM
60 – 150 sec
4 – 6 °C/sec
10 – 20 sec
Pb Free
3 °C/sec
260 °C
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