TGP6336 TriQuint, TGP6336 Datasheet - Page 5

• Manufacturer Part Number: TGP6336
• Description: Wireless Accessories 6.0-18GHz 5-Bit Phase Shifter
• Manufacturer: TriQuint

Specifications of TGP6336

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1004286

Component placement and adhesive attachment assembly notes:
Reflow process assembly notes:
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Interconnect process assembly notes:
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
• thermosonic ball bonding is the preferred interconnect technique
• force, time, and ultrasonics are critical parameters
• aluminum wire should not be used
• discrete FET devices with small pad sizes should be bonded with 0.0007-
• maximum stage temperature: 200ΓC
• vacuum pencils and/or vacuum collets preferred method of pick up
• avoidance of air bridges during placement
• force impact critical during auto placement
• organic attachment can be used in low-power applications
• curing should be done in a convection oven; proper exhaust is a safety
• microwave or radiant curing should not be used because of differential
• coefficient of thermal expansion matching is critical
• AuSn (80/20) solder with limited exposure to temperatures at or above 300ΓC
• alloy station or conveyor furnace with reducing atmosphere
• no fluxes should be utilized
• coefficient of thermal expansion matching is critical for long-term reliability
• storage in dry nitrogen atmosphere
This device can be attached using conductive epoxy or AuSn solder.
inch wire
concern
heating
TriQuint Semiconductor Texas : Phone [phone]
Process and Assembly Notes
Advance Product Information
Fax [phone] Web: www.triquint.com
TGF4350-EPU
5