TGA8061-SCC TriQuint, TGA8061-SCC Datasheet
TGA8061-SCC
Specifications of TGA8061-SCC
Related parts for TGA8061-SCC
TGA8061-SCC Summary of contents
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... GHz Low Noise Amplifier Description The TriQuint TGA8061-SCC is a GaAs monolithic low noise amplifier intended for use as a universal gain block in applications requiring simultaneous flat gain, low noise figure, and low SWR over a very wide bandwidth. Three FET stages with resistive feedback maintain highly repeatable linear phase and amplitude characteristics ...
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... TYPICAL SMALL-SIGNAL POWER GAIN TYPICAL NOISE FIGURE TYPICAL RETURN LOSS TriQuint Semiconductor Texas Phone: (972)994 8465 Product Data Sheet TGA8061-SCC + Fax: (972)994 8504 Web: www.triquint.com = + 25° 25° + 25°C A Input Output 2 ...
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... base-plate temperature, derate linearly at the rate of 9.1 mW/ o Fax: (972)994 8504 Web: www.triquint.com Product Data Sheet TGA8061-SCC ...
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... INPUT RETURN LOSS F = 0.1 – 0.3 GHz MAGNITUDE F = 0.3 – 2.5 GHz F = 2.5 – 3.5 GHz OUTPUT RETURN F = 0.1 – 3.5 GHz LOSS MAGNITUDE TriQuint Semiconductor Texas Phone: (972)994 8465 Product Data Sheet TGA8061-SCC TABLE ° °C) A LIMITS MIN MAX = 0 180 GS ≤ ...
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... Fax: (972)994 8504 Web: www.triquint.com TGA8061-SCC S GAIN ANG (dB ) 0.29 -3 18.0 0.29 -4 18.4 0.29 -5 18.5 0.29 -7 18.5 0.29 -8 18.5 0.30 -10 18.6 0.30 -11 18 ...
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... TES T C ONDITIONS 1.0 GHz 2.0 GHz 3.5 GHz 0.1 GHz 1.0 GHz 2.0 GHz 3.0 GHz 4.0 GHz TEST C ONDITIONS V+/- 0.5 V. Select resistor R1-R4 to set V Fax: (972)994 8504 Web: www.triquint.com TGA8061-SCC TYP UNIT 26 25 dBm dBm 14 12 TYP UNIT = 112 4.5 V +/- 0 ...
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... RECOMMENDED TEST CONFIGURATION RF DC BLOCK In GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. TriQuint Semiconductor Texas Phone: (972)994 8465 Product Data Sheet TGA8061-SCC RECOMMENDED ASSEMBLY DIAGRAM OUT Fax: (972)994 8504 Web: www.triquint.com + V + ...
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Units: Millimeters (inches) Thickness: 0.01016 (0.004) (reference only) Chip edge to bond pad dimensions are shown to center of bond pad Chip size tolerance: +/-0.058 (0.002) Bond pad #1 (RF Input): Bond pad #2 (Vs1): Bond pad #3 (R1): Bond ...