TGS2306 TriQuint, TGS2306 Datasheet - Page 6

• Manufacturer Part Number: TGS2306
• Description: Wireless Accessories DC - 18 GHz SPDT Switch
• Manufacturer: TriQuint

Specifications of TGS2306

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1023348

TriQuint Semiconductor Texas Phone: [phone] Fax: [phone] Email: [e-mail] Web: www.triquint.com
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
1.11 [0.044]
.00 [0.000]
.99 [0.039]
.55 [0.022]
.11 [0.004]
Units: millimeters [inches]
Chip edge to bond pad dimensions are shown to center of bond pads.
Chip size tolerance: ±0.05 [0.002]
RF ground through backside
Bond Pad #1
Bond Pad #2
Bond Pad #3
Bond Pad #4
Bond Pad #5
Bond Pad #6
Bond Pad #7
Thickness: 0.10 [0.004] (reference only)
RF Input
RF Output 1
RF Output 2
VC1
VC2
VC2
VC1
2
Mechanical Drawing
7
1
3
6
Advance Product Information
0.10 x 0.20
0.10 x 0.10
0.10 x 0.10
0.20 x 0.10
0.20 x 0.10
0.10 x 0.10
0.10 x 0.10
5
4
November 9, 2004
[0.004 x 0.008]
[0.004 x 0.004]
[0.004 x 0.004]
[0.008 x 0.004]
[0.008 x 0.004]
[0.004 x 0.004]
[0.004 x 0.004]
TGS2306-EPU
6