MAX2233EVKIT Maxim Integrated Products, MAX2233EVKIT Datasheet - Page 7

• Manufacturer Part Number: MAX2233EVKIT
• Description: RF Modules & Development Tools MAX2233 EVAL KIT MAX2233 EVAL KIT
• Manufacturer: Maxim Integrated Products

Specifications of MAX2233EVKIT

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

The MAX2233 responds to logic-level signals at the
device’s 2-bit DAC inputs, D0 and D1, placing the
device in shutdown mode or into one of three discrete
output power levels. See Table 2 for operating modes
and output power levels. Setting D0 and D1 to a logic-
level low places the device in shutdown mode and
reduces supply current to 0.2µA. The VGA, driver, and
output stage are off in shutdown mode, while the input
impedance is only slightly changed. Setting D0 and D1
to one of the other three modes adjusts the output
power to one of three discrete levels in 10dB steps.
The MAX2232/MAX2233 feature a thermal shutdown
mode that helps to protect the device from damage
when the die temperature becomes excessive. If the
temperature of the die exceeds the thermal shutdown
temperature, T
mode and output power is reduced to a minimum. After
Table 1. MAX2232 Operating Modes
X = Don’t care
___________________________MAX2233
Shutdown
Standby
Variable Gain
Maximum Gain
MODE
900MHz ISM-Band, 250mW Power Amplifiers
RAMP+
RAMP-
SHDN
CTRL
RFIN
V
V
CC
CC
TH
14
13
11
12
3
4
1
V
< 0.6V
> 2.0V
> 2.0V
> 2.0V
, the VGA is forced into a low-gain
SHDN
_______________________________________________________________________________________
GND
2
VGA
V
and Power Management
CC
0.6V ≤ V
16
BIAS
V
≤ 0.4V
< 2.2V
> 2.2V
GND
GND
CTRL
15
5, 6
Digital Gain Control
X
DRIVER
Thermal Shutdown
with Analog or Digital Gain Control
CTRL
MAX2232
SENSOR
TEMP
GND
OUTPUT POWER
0dBm to +24dBm
(P
7, SLUG
V
RFIN
CC
< -35dBm
< -35dBm
+24 dBm
= +3.6V)
= 0dBm,
10
8
TSET
RFOUT
the PA’s die temperature drops below T
remains in thermal shutdown mode for the thermal shut-
down timeout period, t
from TSET to ground sets t
timeout period helps to limit device thermal cycling that
results if the source of the excessive temperature is not
removed. t
Proper attention to voltage supply bypassing is essen-
tial for high-frequency RF circuit stability. Bypass V
with 0.1µF, 10nF, and 100pF capacitors in parallel with
each other to ground. Use separate vias to the ground
plane for each of the bypass capacitors and minimize
trace length to reduce inductance. Use separate vias to
the ground plane for each ground pin. Use low-induc-
tance ground connections.
Decouple SHDN, CTRL, D0, and D1 with 0.1µF capaci-
tors to ground to minimize noise on the internal bias cell.
Use a series resistor (typically 100Ω) to further reduce
coupling of high-frequency signals into the control pins.
Table 2. MAX2233 Operating Modes
Truth Table
Shutdown
Low Power
Medium Power
High Power
RFIN
V
V
D0
D1
CC
CC
MODE
11
12
4
3
1
TH
2-BIT
DAC
is set by the value of C
Applications Information
GND
V
CC
2
VGA
16
BIAS
D1
Functional Diagrams
0
0
1
1
GND
GND
TH
15
5, 6
DRIVER
. A single capacitor, C
TH
MAX2233
SENSOR
. The thermal shutdown
TEMP
GND
D0
0
1
0
1
7, SLUG
TSET
OUTPUT POWER
10
8
(P
TH
.
V
RFIN
CC
< -35dBm
+6.5dBm
, the device
+15dBm
+24dBm
RFOUT
TSET
= +3.6V)
= 0dBm,
TSET
CC
7
,