EFM32-TG822F32-SK Energy Micro, EFM32-TG822F32-SK Datasheet - Page 51

• Manufacturer Part Number: EFM32-TG822F32-SK
• Description: MCU, MPU & DSP Development Tools TG822 Sample Kit
• Manufacturer: Energy Micro

Specifications of EFM32-TG822F32-SK

• Processor To Be Evaluated: EFM32
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

4.5 TQFP48 Package
2012-02-27 - EFM32TG822FXX - d0052_Rev0.95
Figure 4.3. TQFP48
Note:
1. Dimensions and tolerance per ASME Y14.5M-1994
2. Control dimension: Millimeter.
3. Datum plane AB is located at bottom of lead and is coincident with the lead where the lead exists
4. Datums T, U and Z to be determined at datum plane AB.
5. Dimensions S and V to be determined at seating plane AC.
6. Dimensions A and B do not include mold protrusion. Allowable protrusion is 0.250 per side. Dimen-
7. Dimension D does not include dambar protrusion. Dambar protrusion shall not cause the D dimension
8. Minimum solder plate thickness shall be 0.0076.
9. Exact shape of each corner is optional.
Table 4.4. QFP48 (Dimensions in mm)
from the plastic body at the bottom of the parting line.
sions A and B do include mold mismatch and are determined at datum AB.
to exceed 0.350.
DIM
A1
B1
C
A
B
1.000
MIN
-
-
-
-
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
NOM
-
1.200
MAX
-
-
-
-
...the world's most energy friendly microcontrollers
51
DIM
M
N
P
R
S
0.090
0.150
MIN
-
-
-
12DEG REF
www.energymicro.com
0.250 BSC
9.000 BSC
NOM
-
-
0.160
0.250
MAX
-
-
-