EFO-PS1005E5 Panasonic - ECG, EFO-PS1005E5 Datasheet - Page 4

• Manufacturer Part Number: EFO-PS1005E5
• Description: RES CERAMIC 10MHZ .5% SMD
• Manufacturer: Panasonic - ECG
• Series: EFO-PSr
• Type: Ceramicr

Specifications of EFO-PS1005E5

• Frequency: 10MHz
• Features: without Capacitor
• Frequency Stability: ±1.0%
• Frequency Tolerance: ±0.5%
• Capacitance: 21pF
• Operating Temperature: -20°C ~ 80°C
• Mounting Type: Surface Mount
• Package / Case: 2-SMD, Non-Standard
• Size / Dimension: 0.177" L x 0.079" W (4.50mm x 2.00mm)
• Height: 0.047" (1.20mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: EFOPS1005E5; PX100PSTR

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■
Supplied in bulk or taped & reel packing style
● Standard Packing Quantity
● Dimensions for Reel in mm (not to scale)
● Embossed Taping
[Type EFOP, EFOPM]
[Type EFOD, EFODM, EFOLM]
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Type EFOPM
EFOD, EFODM, EFOLM
EFOP, EFOPM
Typical Characteristics ····· Temperature Characteristics
Packaging Specifi cations
(mm)
(mm)
(mm)
(mm)
–0.2
–0.4
–0.6
–0.8
Dim.
Dim.
Dim.
Dim.
t
t
0.8
0.6
0.4
0.2
0.0
1
2
Feeding hole
EFOPS
t
1
t
2
–20 0
Type
Feeding hole
Chip Component
Temperature (°C)
3.7±0.2
2.0±0.1
2.0±0.1
8.4 to 13 MHz
Chip Component
P
1
P
A
A
2.0 to 8.39 MHz
2
A
2
A
20 40 60 80
r
φD
8.3±0.2 16.0±0.3 7.5±0.1 1.75±0.10 8.0±0.1
4.0±0.1
4.0±0.1
Embossed Taping
0
P
P
P
2
P
B
B
2500 pcs./reel
2000 pcs./reel
1000 pcs./reel
φ
1
0
φD
0
1
Chip pocket
A
P
P
0
2
P
E
2
0
P
12.0±0.3 5.5±0.1 1.75±0.10 8.0±0.1
Chip pocket
0
1.5
1.5
C
φD
φD
Type EFOLM (Example)
Tape running
W
W
+0.1
+0.1
0
0
0
0
Tape running direction
D
direction
0.6 max. 3.0 max.
0.3
F
t
F
t
1
1
500 pcs./bag
3.5 max.
W
E
t
E
t
T
2
2
Bulk
3.60
Type EFODM
t
3.20
–0.2
–0.4
–0.6
–0.8
0.8
0.6
0.4
0.2
0.0
P
P
1
1
–20 0
– EC174 –
Temperature (°C)
20 40 60 80
[Type EFOP, EFOPM]
[Type EFOPS, EFOD, EDODM, EFOLM]
[Type EFOPS]
(mm)
(mm)
(mm)
(mm)
(mm)
(mm)
Dim.
Dim.
Dim.
Dim.
Dim.
Dim.
t
t
1
2
Type EFODM
Type EFOLM
Type EFOD
Feeding hole
Dim. (mm)
2.6±0.2
2.0±0.1
16.4
12.4
330±5
180±5
P
Chip Component
P
A
φA
φA
W
W
2
0
Ceramic Resonators, Chip Type
+2.0
+2.0
0
0
A
5.1±0.2 12.0±0.3 5.5±0.1 1.75±0.10 4.0±0.1
4.0±0.1
22.4 max.
18.4 max.
P
80 min.
60 min.
B
φD
0
P
φB
φB
T
T
0
1
Chip pocket
1.5
φD
W
Type EFOLM
+0.1
13.0±0.5
13.0±0.5
0
0
3 max.
3 max.
P
–0.2
–0.4
–0.6
–0.8
2
3.7±0.2
3.4±0.2
4.1±0.2
0.8
0.6
0.4
0.2
0.0
C
C
t
t
Tape running direction
0.6 max. 3.0 max.
1
A
–20 0
F
t
1
Temperature (°C)
21.0±0.8
21.0±0.8
16 to 20 MHz
1.0
1.0
D
D
30 to 50 MHz
r
r
20 40 60 80
t
E
2
00 Sep. 2008
6.0±0.2
4.6±0.2
4.9±0.2
2.00
2
2.0±0.5
2.0±0.5
B
E
E
P
1