MAX16809EVKIT+ Maxim Integrated Products, MAX16809EVKIT+ Datasheet - Page 11

• Manufacturer Part Number: MAX16809EVKIT+
• Description: Power Management Modules & Development Tools EVAL KIT FOR MAX16809
• Manufacturer: Maxim Integrated Products

Specifications of MAX16809EVKIT+

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

8) Connect the power ground plane for the constant-
The MAX16809 dissipates power during normal operat-
ing conditions. The heat transferred to the exposed pad
from the die should be properly dissipated to the board
to prevent the device from entering into thermal shut-
down. The exposed pad land area on the top layer
should be of the same size as that of the exposed pad.
Thermal vias are used to carry the heat from the
exposed pad to other layers of the board and spread it
across the board area through copper planes. Thermal
vias should have a 0.4mm hole size and should be
placed at a distance of 1mm from center to center. For
a four-layer board, these vias should be connected to
the bottom ground plane and to one internal ground
plane. Do not use thermal relief for the thermal vias;
instead, use solid copper to get the minimum thermal
resistance.
current LED driver part of the circuit to the boost-
converter output filter capacitor negative terminal.
______________________________________________________________________________________
Power Dissipation
MAX16809 Evaluation Kit
Use the following equation to calculate the total power
dissipated in the MAX16809 device during normal
operation:
where IN is the LED current in channel N, VS is the
operating voltage of each of the LED driver outputs with
respect to GND pins, I
MAX16809 including the average of MOSFET drive cur-
rent, and V
1W of power, the exposed pad of the device should be
connected to a minimum of two square inches of cop-
per ground plane with 70µ copper thickness.
IN
P
is the input supply voltage. To dissipate
D
=
N
=
∑
0
−
VS
B
15
is the input bias current of
N
×
IN I
+
B
×
V
IN
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