TCPT1200 Vishay, TCPT1200 Datasheet - Page 5

• Manufacturer Part Number: TCPT1200
• Description: Photointerruptors 2mm Gap 950nm
• Manufacturer: Vishay
• Type: Transmissiver

Specifications of TCPT1200

• Maximum Fall Time: 150 us
• Maximum Operating Temperature: + 85 C
• Maximum Rise Time: 150 us
• Minimum Operating Temperature: - 40 C
• Wavelength: 950 nm
• Sensing Method: Transmissive
• Output Collector Emitter Voltage (detector): 70 V
• Maximum Reverse Voltage (emitter): 5 V
• Maximum Collector Current (detector): 20 mA
• Slot Width: 2 mm
• Aperture Width: 0.3 mm
• Output Device: Phototransistor
• Power Dissipation: 150 mW
• Number Of Elements: 1
• Gap Width: 2mm
• Slit Width: 0.3mm
• Reverse Breakdown Voltage: 5V
• Collector-emitter Voltage: 70V
• Forward Current: 25mA
• Collector Current (dc) (max): 20mA
• Fall Time: 150000ns
• Rise Time: 150000ns
• Pin Count: 4
• Mounting: Surface Mount
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Reflow Solder Profiles
Document Number 83753
Rev. 1.9, 13-Mar-07
280
260
240
220
200
180
160
140
120
100
280
260
240
220
200
180
160
140
120
100
80
80
Figure 13. Lead (Pb)-free (Sn) Reflow Solder Profile
Figure 14. Lead Tin (SnPb) Reflow Solder Profile
4 °C/s MAX
4 °C/s MAX
Pre-heating time:
Pre-heating time:
90 ± 30 s
90 ± 30 s
150 °C
150 °C
180 °C
180 °C
4 °C/s MAX
4 °C/s MAX
240 °C
Time (s)
Time (s)
260 °C
230 °C
230 °C
Heating time:
Heating time:
30 ± 10 s
10 - 20 s
19152
19153
Drypack
Devices are packed in moisture barrier bags (MBB) to
prevent the products from absorbing moisture during
transportation and storage. Each bag contains a des-
iccant.
Floor Life
Floor life (time between soldering and removing from
MBB) must not exceed the time indicated in
J-STD-020. According JEDEC, J-STD-020, this com-
ponent is released to Moisture Sensitivity Level 2, for
use of Lead Tin (SnPb) Reflow Solder Profile
(Figure 14) or Level 3, for use of Lead (Pb)-free (Sn)
Reflow Solder Profile (Figure 13).
Floor Life: 12 month (Level 2) or 168 hours (Level 3)
Floor Conditions: T
Drying
In case of moisture absorption, devices should be
baked before soldering. Conditions see J-STD-020 or
Label. Devices taped on reel dry using recommended
conditions 192 h at 40 °C (± 5 °C), RH < 5 % or 96 h
at 60 °C (± 5 °C), RH < 5 %.
amb
Vishay Semiconductors
< 30 °C, RH < 60 %
TCPT1200
www.vishay.com
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