CFULB455KB4Y-B0 Murata, CFULB455KB4Y-B0 Datasheet - Page 70

• Manufacturer Part Number: CFULB455KB4Y-B0
• Description: Signal Conditioning 455KHZ 1500 OHM LEAD
• Manufacturer: Murata
• Type: Ceramic Filterr

Specifications of CFULB455KB4Y-B0

• Rad Hardened: No
• Product: Ceramic Filters
• Frequency: 455 KHz
• Frequency Range: 455 KHz +/- 2 KHz
• Impedance: 1.5 KOhms
• Termination Style: Radial
• Operating Temperature Range: - 20 C to + 80 C
• Lead Free Status / RoHS Status: Compliant

18
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. The component will be damaged when an excessive
2. In the case that the component is cleaned, confirm
3. In case of covering filter with over coat,
4. Do not use strong acidity flux, more than 0.2wt%
1. Do not use this product with bend. The component
2. The component will be damaged when an excessive
3. All kinds of re-flow soldering must not be applied
4. Do not clean or wash the component as it is not
1. The component mounted on the PCB may be damaged if
2. Layout the components on the PCB to minimize the
3. After installing components, if solder is excessively
4. The component may be damaged during mounting
5. When correcting component's position with a soldering
6. Do not clean or wash the component as it is not
7. In case of overcoating the part, coating conditions such
8. Accurate test circuit values are required to measure
9. For safety purposes, avoid applying a direct current
68
Ceramic Discriminators Notice
stress is applied.
no reliability degradation is created.
conditions such as material of resin, cure
temperature, and so on should be evaluated
carefully.
chlorine content, in re-flow soldering.
CDBKB Series Notice (Handling)
CDBLA/CDBLB Series Notice (Handling)
may be damaged if excess mechanical stress is
applied to it mounted on the printed circuit board.
stress is applied.
on the component.
hermetically sealed.
CDSCB Series Notice (Handling)
excessive mechanical stress is applied.
stress imposed on the warp or flexure of the board.
applied to the circuit board, mechanical stress will cause
destruction resistance characteristics to lower. To prevent
this, be extremely careful in determining shape and
dimension before designing the circuit board diagram.
process if some part of mounter such as positioning
claws or nozzle are worn down. The regular maintenance
recommended for mounters should be done to prevent
troubles.
iron, the tip of the soldering iron should not directly touch
the chip component. Depending on the soldering
conditions, the effective area of terminations may be
reduced. The use of solder containing Ag should be
considered to prevent the electrode erosion.
hermetically sealed.
as material of resin, curing temperature, and so on
should be evaluated carefully.
electrical characteristics.
It may be a cause of miscorrelation if there is any
deviation, especially stray capacitance, from the test
circuit in the specification.
between the terminals.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
5. The product, packed in the moisture-proof bag (dry
5. Do not use strong acidity flux, more than 0.2wt%
6. In case of covering discriminator with over coat,
pack), is sensitive to moisture.
The following treatment is required before
applying re-flow soldering, to avoid package
cracks or reliability degradation caused by
thermal stress. When unpacked, store the component
in an atmosphere of below 25 degrees C. and below
65%R.H., and solder within 48 hours.
chlorine content, in flow soldering.
conditions such as material of resin, cure
temperature, and so on should be evaluated
carefully.
[Component Direction]
[Component Layout Close to Board]
Perforation
A
Slit
B
C
Susceptibility to
stress is in the order
of : A>C>B
Put the
component
laterally to the
direction in
which stress
acts.
P05E.pdf
11.1.11