B32560J6102J EPCOS Inc, B32560J6102J Datasheet - Page 26
B32560J6102J
Manufacturer Part Number
B32560J6102J
Description
Manufacturer
EPCOS Inc
Datasheet
1.B32560J6102J.pdf
(32 pages)
Specifications of B32560J6102J
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
B32560J6102J000
Manufacturer:
TDK-EPCOS
Quantity:
30 000
Company:
Part Number:
B32560J6102J189
Manufacturer:
TDK-EPCOS
Quantity:
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Company:
Part Number:
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Manufacturer:
TDK-EPCOS
Quantity:
30 000
3
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 C.
Caution:
Consult us first if you wish to embed uncoated types!
Please read Cautions and warnings and
Important notes at the end of this document.
Embedding of capacitors in finished assemblies
B32560 ... B32564
General purpose (stacked) SilverCap
Page 26 of 32
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