5536614-1 TE Connectivity, 5536614-1 Datasheet - Page 25

• Manufacturer Part Number: 5536614-1
• Description: HARD METRIC CONNECTOR, RECEPTACLE, 8POS
• Manufacturer: TE Connectivity
• Type: Backplane Powerr
• Series: Z-PACKr

Specifications of 5536614-1

• Gender: RCP
• Body Orientation: Right Angle
• Housing Material: Liquid Cryst Polymer
• Number Of Contacts: 8POS
• Number Of Ports: 1Port
• Number Of Terminals: 24
• Pitch (mm): 2mm
• Contact Material: Phosphor Bronze
• Voltage Rating Max: 30VAC
• Mounting Style: Through Hole
• Contact Plating: Gold
• Product Length (mm): 11.88mm
• Connector Type: Backplane
• Row Pitch: 2mm
• Pitch Spacing: 2mm
• No. Of Contacts: 8
• Contact Termination: Right Angle Press Fit
• No. Of Rows: 4
• Rohs Compliant: Yes
• Number Of Rows: 4
• Number Of Positions / Contacts: 8
• Mounting Angle: Right
• Pitch: 2 mm
• Termination Style: Pin
• Product Type: Connector
• Pcb Mounting Orientation: Right Angle
• Post Type: Press-Fit
• Module Type: Power
• Number Of Power Positions: 8
• Press-fit Post Style: Compliant Pin
• Voltage Rating (vac): 30
• Termination Post Length (mm [in]): 3.56 [0.140]
• Sequencing: No
• Post Plating: Tin
• Centerline, Matrix (mm [in]): 2.00 x 2.00 [.079 x .079]
• Contact Type: Socket
• Contact Base Material: Phosphor Bronze
• Contact Plating, Mating Area, Material: Gold (30)
• Connector Style: Receptacle
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant
• Applies To: Printed Circuit Board
• Application: Free-Board
• Lead Free Status / RoHS Status: Compliant

34
Product Facts
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Applications
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Technical Documents
Product Specification
108-2325
Application Specification
114-13215
Catalog 1773096
Revised 2-10
www.tycoelectronics.com
High-density, low profile,
power/signal, blind-mate
connector
Developed to meet next
generation 1U application
by reducing airflow
impedance
Design is customizable
Serves both solder reflow
and press-fit applications
with the same contact
1U Servers
High End Servers
Telecommunications
Switches, requiring low
profile
Hot-pluggable power
supplies
70
60
50
40
30
20
10
0
0
NEW
Current DC Amperes
10
Temperature Rise Vs Current
Temperature Rise Chart
8 Circuits 2 oz 2 Layer
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
MINIPAK HDL
20
Power Connectors & Interconnection Systems
“NEW” MINIPAK HDL Connectors
Tyco Electronics’ new
MINIPAK HDL connector
combines a high-density
power interface into a blind-
mateable board-to-board
connector, which stands
only 8 mm off the edge of
the printed circuit board.
The MINIPAK HDL product
consists of a right-angle
plug and right-angle recep-
tacle, which utilizes an eye
of the needle tail that can
be used in both solder
and press-fit applications.
The contact offers a current
rating of 16 amps, low con-
tact resistance, and mating
forces less than 0.3 pounds
per contact.
30
0 FPM
100 FPM
200 FPM
300 FPM
Power (0 FPM)
Power (100 FPM)
Power (200 FPM)
Power (300 FPM)
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
The connector is designed
and manufactured to be
mass-customizable, allow-
ing the customer to select a
wide array of configurations
and layouts. MINIPAK HDL
connectors also contain
three levels of mating
sequences. This product is
designed specifically for
modular hot-swappable
power distribution systems.
The MINIPAK HDL connector
offers 20% more current
density in a smaller package
than other products cur-
rently offered in the market.
MINIPAK HDL
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
Connector
MULTIBEAM XL
Connector
Simulated Side View of 1U Chassis
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-(0)8002-67666
[.315]
8.00
12.60
[.496]
Airflow