5-104505-3 TE Connectivity, 5-104505-3 Datasheet - Page 7

CONTACT, PIN, 26-22AWG, CRIMP

5-104505-3

Manufacturer Part Number
5-104505-3
Description
CONTACT, PIN, 26-22AWG, CRIMP
Manufacturer
TE Connectivity
Type
Contactr
Series
MTEr
Datasheets

Specifications of 5-104505-3

Pitch (mm)
Not Requiredmm
Gender
Pin
Number Of Contacts
1POS
Number Of Contact Rows
Not Required
Mounting Style
Cable
Body Orientation
Straight
Contact Plating
Gold Over Nickel
Operating Temp Range
-65C to 105C
Termination Method
Crimp
Current Rating (max)
3A
Voltage Rating Max
300VAC
Contact Material
Phosphor Bronze
Contact Resistance Max
12mOhm
Housing Material
Not Required
Housing Color
Not Required
Product Height (mm)
6.05mm
Product Length (mm)
20.62mm
Product Depth (mm)
1.9mm
Connector Type
Contact, Crimp
Current Rating
3A
Contact Termination
Crimp
Pack Quantity
1
Rohs Compliant
Yes
Contact Type
MTE (IDC)
Current, Rating
3 A (Contact)
Diameter, Insulation, Wire
0.035 to 0.054 in.
Material, Contact
Phosphor Bronze
Plating, Contact Mating Area
Tin-Lead over Nickel (50)
Resistance, Insulation
5000 Megohms
Standards
UL Listed, CSA Certified
Temperature, Operating
-65 to +105 °C
Vg, Rating
300 VAC
Voltage, Dielectric Withstanding
750 V
Wire Size
26 to 22 AWG
Contact Gender
Pin
Lead Free Status / RoHS Status
Compliant
For Use With
AMPMODU MTE Connectors
Lead Free Status / Rohs Status
RoHS Compliant part

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
5-104505-3
Manufacturer:
AMP
Quantity:
44 956
Part Number:
5-104505-3
Manufacturer:
MOLEX
Quantity:
35 000
Notes: 1. Tyco Electronics recommends mating gold or duplex plated headers with duplex plated receptacle assemblies.
Surface Mount, Single-Row,
Dual Entry with Compliant
Pin Holddowns
Material and Finish
Housing — Glass-filled thermoplastic,
black, 94V-0 rated
Contacts — Phosphor bronze, plated
as follows:
Plating A — Duplex .000030
[0.00076] gold on contact area,
.000150-.000300 [0.00381-0.00762]
matte tin on solder area all over .000050
[0.00127] nickel
Plating B — Duplex .000010
[0.000254] gold on contact area,
.000150-.000300 [0.00381-0.00762]
matte tin on solder area all over .000050
[0.00127] nickel
Plating C — .000150-.000300
[0.00381-0.00762] matte tin on solder
leads, all over .000050 [0.00127] nickel
Related Product Data
Mateable Headers —
Refer to Mating Post Selection Guide —
page 90
Performance Specifications —
page 186
Note: All part numbers are RoHS compliant.
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
No. of
Pos.
10
11
12
13
14
15
16
17
18
19
20
30
40
3
4
5
6
7
8
9
1.000 [25.40]
1.100 [27.94]
1.200 [30.48]
1.300 [33.02]
1.400 [35.56]
1.500 [38.10]
1.600 [40.64]
1.700 [43.18]
1.800 [45.72]
1.900 [48.26]
2.000 [50.80]
2.100 [53.34]
2.200 [55.88]
3.200 [81.28]
4.300 [109.22]
2. To obtain the minimum mating post length, add .020 [0.51] (not including the post lead in chamfer) to the maximum point-of-contact dimension, and
3. No center hold down.
.500 [12.70]
.600 [15.24]
.700 [17.78]
.800 [20.32]
.900 [22.86]
.062 [1.57] for recommended board thickness if used in bottom entry application
A
1.000 [25.40]
1.100 [27.94]
1.200 [30.48]
1.300 [33.02]
1.400 [35.56]
1.500 [38.10]
1.600 [40.64]
1.700 [43.18]
1.800 [45.72]
1.900 [48.26]
2.900 [73.66]
4.100 [104.14] 2.100 [53.34] 4.200 [106.68]
.200
.300
.400 [10.16]
.500 [12.70]
.600 [15.24]
.700 [17.78]
.800 [20.32]
.900 [22.86]
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
B
[5.08]
[7.62]
Dimensions
See note 3
See note 3
See note 3
See note 3
See note 3
See note 3
See note 3
See note 3
See note 3
See note 3
See note 3
See note 3
See note 3
See note 3
See note 3
See note 3
See note 3
See note 3
See note 3
AMPMODU Interconnection System
Mod IV Receptacle Assemblies, Single-Row, Surface Mount,
.100 [2.54] Centerline with Compliant Pin Hold Downs
C
P.C. Board
[3.56]
[1.91]
.140
.075
[1.07±0.08]
.042±.003
[0.97]
.038
1.000 [25.40]
1.100 [27.94]
1.200 [30.48]
1.300 [33.02]
1.400 [35.56]
1.500 [38.10]
1.600 [40.64]
1.700 [43.18]
1.800 [45.72]
1.900 [48.26]
2.000 [50.80]
2.100 [53.34]
3.100 [78.74]
[1.02±0.08]
Dia. Typ.
(For bottom
entry or pass
thru applica-
tions)
.040±.003
.400 [10.16]
.500 [12.70]
.600 [15.24]
.700 [17.78]
.800 [20.32]
.900 [22.86]
Dia.
D
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Recommended PC Board Pad Pattern
5-147744-1
5-147744-2
5-147744-3
5-147744-4
5-147744-5
5-147744-6
5-147744-7
5-147744-8
5-147744-9
6-147744-0
6-147744-1
6-147744-2
6-147744-3
6-147744-4
6-147744-5
6-147744-6
6-147744-7
6-147744-8
7-147744-8
8-147744-8
(.008 [0.20] thick stencil)
Plating A
[2.79]
.110
C
Contact Plating/ Part Nos.
.030 0.76
.025
B
Packaged in Tubes
Typ.
D
[
0.64
A
D
5-147743-1
5-147743-2
5-147743-3
5-147743-4
5-147743-5
5-147743-6
5-147743-7
5-147743-8
5-147743-9
6-147743-0
6-147743-1
6-147743-2
6-147743-3
6-147743-4
6-147743-5
6-147743-6
6-147743-7
6-147743-8
7-147743-8
8-147743-8
Plating B
]
[2.54]
.100
[1.52]
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
.060
Typ.
[2.54]
.100
Min.
5-147742-1
5-147742-2
5-147742-3
5-147742-4
5-147742-5
5-147742-6
5-147742-7
5-147742-8
5-147742-9
6-147742-0
6-147742-1
6-147742-2
6-147742-3
6-147742-4
6-147742-5
6-147742-6
6-147742-7
6-147742-8
7-147742-8
8-147742-8
Plating C
C
[1.75]
.069
[2.28] Typ.
[5.78]
.090
.228
[1.07±0.08]
[1.07±0.08]
.042±.003
.042±.003
[0.51]
.020
5-147724-1
5-147724-2
5-147724-3
5-147724-4
5-147724-5
5-147724-6
5-147724-7
5-147724-8
5-147724-9
6-147724-0
6-147724-1
6-147724-2
6-147724-3
6-147724-4
6-147724-5
6-147724-6
6-147724-7
6-147724-8
7-147724-8
8-147724-8
Plating A
Dia.
Dia.
Standoffs
Typ.
[6.73]
.265
Typ.
Contact Plating/ Part Nos.
[2.72]
Packaged in Tape & Reel
.107
[3.77]
.148
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
5-147730-1
5-147730-2
5-147730-3
5-147730-4
5-147730-5
5-147730-6
5-147730-7
5-147730-8
5-147730-9
6-147730-0
6-147730-1
6-147730-2
6-147730-3
6-147730-4
6-147730-5
6-147730-6
6-147730-7
6-147730-8
7-147730-8
8-147730-8
Plating B
(Localized Gold
Point of
Contact
Plate Area)
(Depressed)
5-147731-1
5-147731-2
5-147731-3
5-147731-4
5-147731-5
5-147731-6
5-147731-7
5-147731-8
5-147731-9
6-147731-0
6-147731-1
6-147731-2
6-147731-3
6-147731-4
6-147731-5
6-147731-6
6-147731-7
6-147731-8
7-147731-8
8-147731-8
[5.28] Max.
.208
Plating C
187
5

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