9-103765-0 TE Connectivity, 9-103765-0 Datasheet - Page 119

• Manufacturer Part Number: 9-103765-0
• Description: BOARD-BOARD CONN, HEADER, 40WAY, 1ROW
• Manufacturer: TE Connectivity
• Type: Unshrouded Headerr
• Series: AMPMODU Mod IIr

Specifications of 9-103765-0

• Pitch (mm): 2.54mm
• Gender: HDR
• Number Of Contacts: 40POS
• Number Of Contact Rows: 1
• Mounting Style: Through Hole
• Body Orientation: Right Angle
• Contact Plating: Gold Over Nickel
• Operating Temp Range: -65C to 105C
• Termination Method: Solder
• Current Rating (max): 3/ContactA
• Contact Material: Phosphor Bronze
• Housing Material: Thermoplastic
• Housing Color: Black
• Product Height (mm): 3.51mm
• Product Length (mm): 101.19mm
• Product Depth (mm): 9.4mm
• Pitch Spacing: 2.54mm
• No. Of Rows: 1
• No. Of Contacts: 40
• Contact Termination: Right Angle Through Hole
• Rohs Compliant: Yes
• Product Type: Connector
• Mount Angle: Right Angle
• Pcb Mount Retention: Without
• Surface Mount Compatible: No
• Board Standoff: Without
• Mounting Ears: Without
• Mating Connector Lock: Without
• Post Size (mm [in]): 0.64 [.025]
• Mating Post Length (mm [in]): 5.84 [0.230]
• Panel Mount Retention: Without
• Termination Post Length (mm [in]): 2.29 [0.090]
• Solder Tail Contact Plating: Tin over Nickel
• Header Type: Breakaway
• Number Of Positions: 40
• Centerline (mm [in]): 2.54 [0.100]
• Row-to-row Spacing (mm [in]): 2.54 [0.100]
• Number Of Rows: 1
• Selectively Loaded: No
• Mount Type: Printed Circuit Board
• Contact Plating, Mating Area, Material: Gold (30)
• Contact Shape: Square
• Contact Base Material: Phosphor Bronze
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Rohs/elv Compliance History: Always was RoHS compliant
• High Temperature Housing: No
• High Speed Serial Data Connector: No
• Lead Free Status / RoHS Status: Compliant

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202
Product Facts
Catalog 1307819
Catalog 1307819
Revised 6-04
Revised 6-04
www.tycoelectronics.com
www.tycoelectronics.com
Surface Mount Leads
Contact Material:
phosphor bronze
High temperature, black
thermoplastic housings,
94V-0 rated, capable of
withstanding IR or vapor-
phase reflow
Gold/tin-lead duplex plating
for reliable mating
interconnection and solder
interface
Metallic hold downs provide
retention in the PC board
prior to and during the
reflow process . . . and
strain relief after soldering
Hold downs provide for
proper lead-to-pad
registration
Closed-entry receptacle
housings provide lead-in
ramp for positive mating
Receptacle contacts employ
dual cantilever beams and
built-in anti-overstress for
reliable connections
Recognized under the
Component Program
of Underwriters
Laboratories Inc.
File No. E28476
Certified by
Canadian Standards
Association,
File No. LR 7189
Dimensions are in inches and
Dimensions are in inches and
millimeters unless otherwise
millimeters unless otherwise
specified. Values in brackets
specified. Values in brackets
are metric equivalents.
are metric equivalents.
AMPMODU Interconnection System
The AMPMODU 0.025
[0.64] square
interconnection system is
an industry standard that
has provided level III and IV
through-hole
interconnections to almost
every industry and
marketplace for years. As
technology advances, so
has the AMPMODU product
line.
Surface mount vertical
receptacle assemblies are
available to meet your level II
packaging needs as process
technologies evolve from
wave soldering to surface-
mount reflow (infrared and
vapor-phase) processes.
AMPMODU surface-mount
receptacle assemblies are
offered in vertical dual entry
configurations. These
receptacles are available in
single-row and double-row
configurations with a contact
centerline spacing of .100 x
.100 [2.54 x 2.54].
Mod IV Surface-Mount Vertical Receptacle Assemblies,
.100 x .100 [2.54 x 2.54] Centerline
Dimensions are shown for
Dimensions are shown for
reference purposes only.
reference purposes only.
Specifications subject
Specifications subject
to change.
to change.
AMPMODU surface-mount
vertical receptacle
assemblies continue to
provide the proven features
and benefits of the through-
hole counterparts in the
AMPMODU product family.
Closed-entry style housing
design provides a lead-in
ramp for positive mating of
contacts, virtually
eliminating the possibility of
stubbing. The dual-beam
receptacle contact design,
coupled with gold plating in
the contact area, provides a
reliable interface. The
contacts also provide built-
in anti-overstress
protection. Tin-lead plating
on the solder tails also
enhances solderability.
The incorporation of
compliant metallic hold
downs on receptacle
assemblies offers multiple
benefits. The hold downs
provide for proper lead-to-
pad registration and
provide retention to the PC
USA: 1-800-522-6752
USA: 1-800-522-6752
Canada: 1-905-470-4425
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
C. America: 52-55-5-729-0425
board prior to and during
processing. Used with a
plated through-hole, the
hold downs are soldered
during the reflow process
and serve as a strain relief
for the solder joints during
mating/unmating.
The design of the hold
downs results in an
excellent ratio of
insertion/extraction forces
(into the PC board); 20 lb.
[89 N] maximum insertion
force per pair and 10 lb.
[44.5 N] minimum extraction
force per pair (unsoldered).
No tools are required for
insertion.
South America: 55-11-3611-1514
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
Japan: 81-44-844-8013
UK: 44-141-810-8967
UK: 44-141-810-8967