87159-1 TE Connectivity, 87159-1 Datasheet - Page 33

• Manufacturer Part Number: 87159-1
• Description: Headers & Wire Housings 05 MODI CRMP S-I HSG SR .156CL
• Manufacturer: TE Connectivity
• Type: Housingr

Specifications of 87159-1

• Number Of Contacts: 5POS
• Number Of Contact Rows: 1
• Body Orientation: Straight
• Pitch (mm): 3.96mm
• Gender: RCP
• Housing Material: Nylon 66
• Housing Color: Black
• Product Height (mm): 6.35mm
• Product Depth (mm): 16.26mm
• Product Length (mm): 19.81mm
• Product Type: Receptacles / Sockets - Housings
• Pitch: 3.96 mm
• Number Of Positions / Contacts: 5
• Number Of Rows: 1
• Mounting Style: Wire
• Profile: Low
• Keyed: Yes
• Stamped: No
• Number Of Positions: 5
• Centerline, Matrix (mm [in]): 3.96 [.156]
• Number Of Keys: 2
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant
• Applies To: Wire/Cable
• Lead Free Status / RoHS Status: Compliant

Catalog 1307819
Revised 8-08
www.tycoelectronics.com
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
AMPMODU Interconnection System
Performance Specifications
Dual In-Line Package (DIP) Shunts — 7600 Series
Current Rating —
Standard pressure — 2 amperes for +20˚C rise above ambient (one conductor per shunt
Machine insertable — 1 ampere for +20˚C rise above ambient (one conductor per shunt)
Insulation Resistance — 1x 10
Dielectric Withstanding Voltage — 500 VDC min.
Capacitance — 2 picofarads max. between adjacent straps
Temperature Rating — -55˚C to +105˚C
Terminal Strength (Bend Test) — Two 45˚ bend cycles per MIL-STD-202, Method 211, Condition B
Solder Bridging —
Cut straps can be reconnected by solder bridging. Solder bridging recommendations are:
Post Shunts
Current Rating —
3 amperes max. unless otherwise noted
Temperature Rating — -65˚C to +105˚C (gold) -40˚C to +85˚C (tin)
Technical Documents
Various technical documents are available for your use:
Product Specifications describe technical performance characteristics and verification
tests. They are intended for the Design, Component and Quality Engineer.
108-7533
108-1445
108-1476
108-1674
108-9057
108-9062
108-37006
Application Specifications describe requirements for using the product in its intended
application and/or crimping information. They are intended for the Packaging and Design
Engineer and the Machine Setup Person.
114-1045
114-1054
114-1059
114-1074
Instruction Sheets provide instructions for assembling or applying the product. They are
intended for the Manufacturing Assembler or Operator.
408-7768
408-3208
408-3230
408-3251
408-3276
•Use low temperature solder (60/40 tin/lead)
•Use solder tip approximately 1/32 [0.79] in diameter
•Do not let solder tip come in contact with plastic material
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Dual In-Line Package (DIP) Shunts
2mm Mini Shunt
Economy Shunt, Multiposition Shunt
Dual Beam Shunt
Low Profile Shunt
Tandem Spring Shunt
Novo Shunt with Handle
Tandem Spring Shunt
Dual In-Line Package (DIP) Shunts
Economy Shunt, Dual Beam Shunt, Low Profile Shunt, Multiposition
Shunt
2mm Mini Shunt
Dual In-Line Package (DIP) Shunts
Tandem Spring Shunt
Economy Shunt, Dual Beam Shunt, Low Profile Shunt
Multiposition Shunt
2mm Mini Shunt
10
ohms min. at 100 VDC
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208a
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