HSEC8-150-01-SM-D-EM2 Samtec Inc, HSEC8-150-01-SM-D-EM2 Datasheet
HSEC8-150-01-SM-D-EM2
Manufacturer Part Number
HSEC8-150-01-SM-D-EM2
Description
Manufacturer
Samtec Inc
Type
Card Edger
Datasheet
1.HSEC8-150-01-SM-D-EM2.pdf
(1 pages)
Specifications of HSEC8-150-01-SM-D-EM2
Number Of Contacts
100POS
Number Of Contact Rows
2
Body Orientation
Straight
Card Thickness (mm)
1.75mm
Contact Plating
Gold Over Nickel
Contact Material
Beryllium Copper
Termination Method
Solder
Mounting Style
Edge
Product Height (mm)
7mm
Operating Temp Range
-55C to 125C
Pitch (mm)
0.8mm
Housing Material
Liquid Cryst Polymer
Current Rating (max)
3.1A
Lead Free Status / RoHS Status
Compliant
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?HSEC8-EM
Insulator Material:
Liquid Crystal Polymer
Contact: BeCu
Plating: Au or Sn over
50µ" (1,27µm) Ni
Current Rating:
3.1A @ 30°C Temperature Rise
Operating Temp:
-55°C to +125°C
Card Insertion Depth:
(3,15mm) .125" nominal
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead–Free Solderable: Yes
RoHS Compliant: Yes
Note: Some lengths, styles
and options are non-standard,
non-returnable.
0,80
Note: Requires PCB
thickness of (1,60mm)
.062" ±(0,08mm) .003"
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?DEC8
Insulator Material:
Black ABS
Contact:
BeCu
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Current Rating:
3.1A @ 95°C relative to 125°C
Operating Temp:
-55°C to +125°C
RoHS Compliant: Yes
F-209-1
–EM to –DV
SPECIFICATIONS
SPECIFICATIONS
APPLICATIONS
APPLICATIONS
–EM to EEDP–DV
EEDP
Series
mm
Mates with:
(1,60mm) 0.62" thick
cards, EEDP, HSC8
Mates with:
(1,60mm) .062"
thick cards, HSC8
CARD SOCKETS
(17,58)
HSEC8
.692
(9,83)
.387
DEC8
(1,75)
.069
02
01
No. of Positions x (0,80) .0315 + (18,40) .724
No. of Positions x (0,80) .0315 + (7,80) .307
No. of Positions x (0,80) .0315 + (15,20) .598
No. of Positions x (0,80) .0315 + (4,60) .181
02
01
A
1
1
C
10, 20, 30, 40, 50, 60
WWW.SAMTEC.COM
HSEC8–130–01–S–D–EM2
POSITIONS
40, 50, 60
PER ROW
A
POSITIONS
(0,80) .0315
PER ROW
B
B
(4,00) .157
01
(5,00)
(5,60)
.197
.220
(7,80)
.307
Card Thickness
(7,00)
.276
= (1,60) .062"
STYLE
(4,99)
LEAD
.197
–01
Moulding removed
PLATING
OPTION
POSITIONS
PER ROW
HSEC8-EM,
DEC8 SERIES
for clarity
Gold on contact,
Matte Tin on tail
= 30µ" (0,76µm)
40
50
60
–S
(18,90)
(22,90)
(26,90)
1.059
.744
.902
POSITIONS
PER ROW
A
Note: Other Gold plating
options available.
Contact Samtec.
ALSO AVAILABLE
Polarized mates for EEDP
60
40
50
CONNECTOR
(36,60)
(44,60)
(52,60)
Series twinax cables
1.441
1.756
2.071
HSEC8–113
HSEC8–125
HSEC8–137
HSEC8–149
DEC8–140–01–S
D
B
Gold on contact
= 30µ" (0,76µm)
(47,75)
(55,75)
(63,75)
1.880
2.195
2.510
PLATING
A
–S
(36,60)
(44,60)
(52,60)
1.441
1.756
2.071
B
= (1,60mm)
.062" thick
EEDP–08
EEDP–16
EEDP–24
EEDP–32
–EM2
CABLE
EM2
PCB
(18,90)
(22,91)
(26,90)
1.059
.744
.902
C
™
™
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