RU8-160-25-SE-H-DV Samtec Inc, RU8-160-25-SE-H-DV Datasheet

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RU8-160-25-SE-H-DV

Manufacturer Part Number
RU8-160-25-SE-H-DV
Description
.8mm BOARD TO BOARD KIT
Manufacturer
Samtec Inc
Type
Riser Card Kitr
Datasheet

Specifications of RU8-160-25-SE-H-DV

Number Of Contacts
120POS
Number Of Contact Rows
2
Body Orientation
Straight
Card Thickness (mm)
1.6mm
Contact Plating
Gold Over Nickel
Contact Material
Beryllium Copper
Termination Method
Solder
Mounting Style
Surface Mount
Product Height (mm)
25mm
Operating Temp Range
-55C to 125C
Pitch (mm)
0.8mm
Housing Material
Liquid Cryst Polymer
Housing Color
Black
Current Rating (max)
3.1A
Lead Free Status / RoHS Status
Not Compliant
Mates with:
HSEC8
For complete specifi cations
see www.samtec.com?HSC8
Conductor:
1
Contact Area:
Hard Gold Plated
Insulator: FR-4
RoHS Compliant:
Yes
HIGH SPEED RISER CARD KIT
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?RU8
Connector:
Insulator Material:
Black LCP
Contact:
BeCu
Plating:
Au or Sn over
50µ" (1,27µm) Ni
Current Rating:
3.1A @ 30°C
Temperature Rise
(See website for details)
Operating Temp:
-55°C to +125°C
Processing:
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (40-60)
RoHS Compliant:
Yes
Note: Some sizes, styles and
options are non-standard,
non-returnable.
F-210-1
/
2
SPECIFICATIONS
SPECIFICATIONS
(0,80mm) .0315"
RU8, HSC8 SERIES
oz Copper
POSITIONS
PER SIDE
NO. OF
–040
–050
–060
SIGNAL
TOTAL
LINES
–SE
40
50
60
SIGNAL
TOTAL
PAIRS
–DP
26
32
38
Note: Some lengths,
styles and options
are non-standard,
non-returnable.
RU8
HSC8
®
(1,60)
Signal
.062
01
1
–SE
–BL (Required with –25 & –30)
POSITIONS
40, 50, 60
Ground
PER ROW
–040, –050, –060
No. of Positions per Side x (0,80) .0315 + (4,45) .175
POSITIONS PER SIDE
–SE
NUMBER OF
A
RU8–140–25–SE–S–DV–BL
WWW.SAMTEC.COM
WWW.SAMTEC.COM
(–19 Only)
B
= (30mm) 1.180"
= (19mm) .748"
= (25mm) .984"
–DP
HEIGHT
STACK
–19
–25
–30
= Differential
ROUTING
SIGNAL
= Single-
(1,60)
–DP
.062
–SE
–DP
Ended
Pair
(12,51)
Signal
.492
= (1,60mm)
STYLE
thick card
CARD
–02
.062"
(Plating for connec-
(7,98)
Kit contains two connectors
and one card. Assembly required.
.314
Gold on contact,
0,80mm pitch RU8
25mm Stack Height
Single-Ended Signaling
Differential Pair Signaling
Performance data for other stack heights and complete
test data available at www.samtec.com?RU8 or contact
sig@samtec.com
= 30µ" (0,76µm)
Matte Tin on tail
Plating for Card
(7,01)
PLATING
.276
OPTION
is Hard Gold
–S
tors)
Ground
A
POSITIONS
PER SIDE
NO. OF
HEIGHT
STACK
= (19mm)
40
50
60
= (25mm)
= (30mm)
–19
–25
–30
1.180"
.748"
.984"
DV
HSC8–040–02–25–DP
(Not available
Socket only)
on –19 stack
(39,80)
(47,80)
(55,80)
1.567
1.882
2.197
(Bottom
= Board
A
–BL
height)
Rated @ 3dB Insertion Loss
Locks
BL
(50,39)
(58,39)
(66,40)
7.5 GHz / 15 Gbps
7.5 GHz / 15 Gbps
1.984
2.299
2.614
HEIGHT
STACK
B
• Board lock option
–19
–25
–30
= Differential Pair
= Single-Ended
SIGNAL
TOTAL
ROUTING
LINES
SIGNAL
–SE
40
50
60
= Tape & Reel
–SE
–DP
Leave blank
OPTION
= (5,50mm)
(25,84) 1.017
OTHER
Place Pad
Polyimide
(14,84) .584
(20,84) .820
.217" DIA
for Trays
–TR
Pick &
–K
Film
SIGNAL
TOTAL
PAIRS
A
–DP
26
32
38

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