147668-3 TE Connectivity, 147668-3 Datasheet - Page 180

• Manufacturer Part Number: 147668-3
• Manufacturer: TE Connectivity
• Type: Card Edger

Specifications of 147668-3

• Number Of Contacts: 60POS
• Body Orientation: Straight
• Contact Plating: Gold
• Contact Material: Beryllium Copper
• Termination Method: Crimp
• Mounting Style: Through Hole
• Pitch (mm): 1.27mm
• Housing Material: Thermoplastic
• Housing Color: Black
• Lead Free Status / RoHS Status: Compliant

180
Recommended PC
Board Layouts
Related PC Board Data:
Recommended Board Thickness—
.055-.070 [1.40-1.78]
Recommended Chamfer of Mating
Edge of Boards—.015 [0.38] x 45°
Recommended Pad Plating—Tin
.000150-.000400 [0.00381-0.01016]
thick
Catalog 1654080
Issued 7-03
www.tycoelectronics.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Card Edge Connectors
(Board-to-Board, Wire-to-Board)
DUO-TYNE Flag Connectors
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Contact Pads
[ 7 . 1 1
.280
±0.13
±.008
[1.57
.062
[2.92]
.115
]
±.005
±0.13
Min.
]
Positions
No. of
(Continued)
Contact Pads
12
14
15
18
22
3
5
6
9
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
[1.12
.044
±0.13
±.005
A
A
]
[±0.08]
±.003
[±0.08]
±.003
[3.96
.156
Dimension
10.16
18.09
22.05
1.337
33.96
1.805
45.85
2.117
53.77
2.272
57.71
2.741
69.62
3.365
85.47
±.005
±0.13
.400
.712
.868
A
]
Retaining Dimples
.148 [3.76] R.
(Optional)
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
[0.36/0.41]
.014/.016
[1.78
.070
±.005
±0.13
]