MEC8-160-01-L-D-EM2 Samtec Inc, MEC8-160-01-L-D-EM2 Datasheet
MEC8-160-01-L-D-EM2
Manufacturer Part Number
MEC8-160-01-L-D-EM2
Description
Manufacturer
Samtec Inc
Type
Card Edger
Datasheet
1.MEC8-160-01-L-D-EM2.pdf
(1 pages)
Specifications of MEC8-160-01-L-D-EM2
Number Of Contacts
120POS
Number Of Contact Rows
2
Body Orientation
Straight
Card Thickness (mm)
1.2mm
Contact Plating
Gold Over Nickel
Contact Material
Phosphor Bronze
Termination Method
Solder
Mounting Style
Edge
Product Height (mm)
7mm
Operating Temp Range
-55C to 125C
Pitch (mm)
0.8mm
Housing Material
Liquid Cryst Polymer
Housing Color
Black
Current Rating (max)
1.8A
Voltage Rating Max
265VAC
Lead Free Status / RoHS Status
Compliant
F-210-1 SUPPLEMENT
Mates with:
(1,60mm) .062" thick cards,
EEDP
Note: Some sizes, styles and
options are non-standard,
non-returnable.
Mates with:
(1,60mm) .062" thick cards
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?MEC8-EM
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over 50µ"
(1,27µm) Ni
Operating Temp Range:
-55°C to +125°C
Insertion Depth:
(4,32mm) .170" to
(5,66mm) .223"
Current Rating:
1.8A @ 30°C Temperature Rise
Voltage Rating:
265 VAC
RoHS Compliant:
Yes
Lead–Free Solderable:
Yes
RIGHT ANGLE/EDGE MOUNT SOCKETS
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?MEC8-RA
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating: Au or Sn over 50µ"
(1,27µm) Ni
Operating Temp Range:
-55°C to +125°C
Insertion Depth:
(3,94mm) .155" to
(6,25mm) .246"
Current Rating:
1.8A @ 30°C Temperature Rise
Voltage Rating: 265 VAC
RoHS Compliant:
Yes
Lead–Free Solderable:
Yes
Note: Some sizes, styles and
options are non-standard,
non-returnable.
SPECIFICATIONS
SPECIFICATIONS
(0,80mm) .0315"
MEC8-RA, MEC8-EM SERIES
(1,80)
(5,00)
.071
MEC8
.197
MEC8
02
01
10, 13, 20, 25, 30, 37, 40, 49, 50
(0,90) .035 x
(1,40) .055 DIA
10, 20, 30, 40, 50, 60, 70
No. of Positions x (0,80) .0315 + (6,20) .244
No. of Positions x (0,80) .0315 + (3,00) .118
A
02
01
No. of Positions x (0,80) .0315 + (4,60) .181
No. of Positions x (0,80) .0315 + (7,80) .307
1
(0,80) .0315
(2,00) .0787
1
(0,80)
.0315
POSITIONS
A
PER ROW
(2,00) .0787
MEC8–110–02–L–D–RA1
POSITIONS
WWW.SAMTEC.COM
PER ROW
B
B
(4,00)
.157
MEC8–140–02–L–D–EM2
(7,40)
(4,00) .157
(1,80)
.291
.071
(1,40)
02
.055
DIA
02
POSITIONS
PER ROW
(5,77)
.227
= 10µ" (0,25µm) Gold on contact,
40
50
(8,50)
MEC8–140–02–L–D–RA1
.335
(7,00)
.276
PLATING
(2,65)
OPTION
.104
= 10µ" (0,25µm) Gold on contact,
(1,48)
.058
Matte Tin on tail
(18,90)
(22,90)
.744
.902
PLATING
OPTION
A
(9,10)
.358
(0,95)
–L
.037
Matte Tin on tail
(36,60)
(44,60)
1.441
1.756
B
–L
(3,53)
.139
1mm mating card thickness option.
D
0,80mm MEC8-RA
5,78mm Stack Height
Single-Ended Signaling
Differential Pair Signaling
For complete test data go to
www.samtec.com?MEC8-RA or contact
sig@samtec.com
(1,05)
.041
SPECIFIC OPTION
POSITIONS
PER ROW
APPLICATION
• 1mm mating card
• Latching option (mates
Call Samtec.
40
50
60
70
RA1
SPECIFIC OPTION
MEC8–160–02–L–D–EM2
D
Call Samtec.
thickness option
with EEDP series)
APPLICATION
(18,90)
(22,90)
(26,90)
(30,90)
1.059
1.217
.744
.902
A
= (1,60mm) .062"
6.5 GHz / 13 Gbps
8.0 GHz / 16 Gbps
–EM2
(36,60)
(44,60)
(52,60)
(60,60)
thick PCB
1.441
1.756
2.071
2.386
–EM2
= Tape & Reel
Insertion Loss
Rated @ 3dB
B
OPTION
OTHER
Packaging
–TR
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