MEC1-140-02-F-D-EM1 Samtec Inc, MEC1-140-02-F-D-EM1 Datasheet
![no-image](/images/manufacturer_photos/0/5/579/samtec_inc_sml.jpg)
MEC1-140-02-F-D-EM1
Manufacturer Part Number
MEC1-140-02-F-D-EM1
Description
Manufacturer
Samtec Inc
Type
Card Edger
Datasheet
1.MEC1-140-02-F-D-EM1.pdf
(1 pages)
Specifications of MEC1-140-02-F-D-EM1
Number Of Contacts
80POS
Number Of Contact Rows
2
Body Orientation
Straight
Card Thickness (mm)
1.6mm
Contact Plating
Gold Over Nickel
Contact Material
Phosphor Bronze
Termination Method
Solder
Mounting Style
Edge
Product Height (mm)
6.81mm
Operating Temp Range
-55C to 125C
Pitch (mm)
1mm
Housing Material
Liquid Cryst Polymer
Housing Color
Black
Current Rating (max)
1.5A
Lead Free Status / RoHS Status
Compliant
Mates with:
(1,60mm) .062" card
Note: Some sizes, styles and
options are non-standard,
non-returnable.
Mates with:
(1,60mm) .062" card
RIGHT ANGLE/EDGE MOUNT SOCKETS
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?MEC1-RA
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over 50µ"
(1,27µm) Ni
Current Rating: 1.5A @ 80°C
(See website for details)
Operating Temp Range:
-55°C to +125°C
Insertion Depth:
(5,84mm) .230" to
(8,13mm) .320"
RoHS Compliant: Yes
Processing:
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead–Free Solderable: Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (05-40)
(0,15mm) .006" max (50-70)
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?MEC1-EM
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over 50µ"
(1,27µm) Ni
Operating Temp Range:
-55°C to +125°C
Insertion Depth:
(5,84mm) .230" to
(8,13mm) .320"
RoHS Compliant:
Yes
Processing:
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead–Free Solderable: Yes
Note: Some sizes, styles and
options are non-standard,
non-returnable.
F-210
MEC1-RA, MEC1-EM SERIES
(1,00mm) .03937"
SPECIFICATIONS
SPECIFICATIONS
(8,89)
MEC1
.350
(1,24)
.049
MEC1
(6,81)
.268
(1,00) .03937 + (2,54) .100
02
01
(No. of Positions + 2) x
(4,57)
(No. of Positions + 2)
.180
05, 08, 20, 30,
40, 50, 60, 70
x (1,00) .03937
(1,00) .03937 + (12,45) .490
1
02
01
(No. of Positions + 2) x
.03937
(No. of Positions + 2)
(1,00)
(3,15)
.124
05, 08, 20, 30,
40, 50, 60, 70
x (1,00) .03937
(0,36) .014
POSITIONS
1
PER ROW
.03937
(1,00)
on the mating board be Gold plated.
WWW.SAMTEC.COM
MEC1–120–02–L–D–RA1–SL
POSITIONS
(11,68)
PER ROW
(1,78)
Samtec recommends that pads
.460
.070
DIA
APPLICATION
(6,81)
(0,36)
.014
(11,94)
.268
.470
(2,51)
= (1,60mm)
.099
MEC1–130–02–L–D–EM2
thick card
(8,89)
CARD
SLOT
.350
–02
.062"
(4,70)
.185
(8,13)
.320
(1,27)
.050
Note: Other Gold plating options
available. Contact Samtec.
Note: Other Gold plating
options available.
Contact Samtec.
= 10µ" (0,25µm) Gold on contact,
= Gold fl ash on contact,
(5,21)
.205
02
(3,12)
(0,64)
.123
.025
Gold on contact,
= Gold fl ash on contact,
Matte Tin on tail
= 10µ" (0,25µm)
Matte Tin on tail
PLATING
OPTION
Matte Tin on tail
Matte Tin on tail
–F
–L
–F
–L
(8,13)
Complete test data available at
www.samtec.com?MEC1-RA or contact sig@samtec.com
.320
(1,19)
1mm MEC1-RA
6,81mm Stack Height
Single-Ended Signaling
Differential Pair Signaling
.047
PLATING
OPTION
±
(0,38)
.015
• Elevated body height
• Non-polarized
Call Samtec.
D
SPECIFIC OPTION
POSITIONS
POSITIONS
APPLICATION
PER ROW
PER ROW
MEC1–120–02–F–D–EM2
• Edge mount leads for
• Non-polarized
Call Samtec.
APPLICATION
(0,80mm) .031"
thick board
05
08
20
30
40
50
60
70
05
08
20
30
40
50
60
70
RA1
D
SPECIFIC
OPTION
5.5 GHz / 11 Gbps
4.5 GHz / 9 Gbps
Insertion Loss
Rated @ -3dB
53, 54, 115 & 116
53, 54, 115 & 116
31, 32, 63 & 64
31, 32, 63 & 64
POLARIZED
POLARIZED
POSITIONS
POSITIONS
15, 16
21, 22
31, 32
41, 42
15, 16
21, 22
31, 32
41, 42
3, 4
5, 6
3, 4
5, 6
EM2
SL