2NBS16-TF6-253LF Bourns Inc., 2NBS16-TF6-253LF Datasheet - Page 2
![](/photos/30/47/304772/2qsp16-rf6-103lf_sml.jpg)
2NBS16-TF6-253LF
Manufacturer Part Number
2NBS16-TF6-253LF
Description
Manufacturer
Bourns Inc.
Type
Networkr
Datasheet
1.2NBS16-TF6-253LF.pdf
(4 pages)
Specifications of 2NBS16-TF6-253LF
Technology
Thin Film
Resistance
25000/50000Ohm
Power Rating
1W
Power Rating Per Resistor
1/10W
Number Of Resistors
16
Tolerance (+ Or -)
1%
Circuit Designator
LADDER
Package / Case
SOIC
Mounting Style
Surface Mount
Temperature Coefficient
±100
Military Standard
Not Required
Operating Temp Range
-55C to 125C
No. Of Terminals
16
Case Style
Molded
Failure Rate
Not Required
Termination Style
Gull Wing
Terminal Pitch
1.27
Product Length (mm)
9.98mm
Product Depth (mm)
6.2mm
Product Height (mm)
1.75mm
Lead Free Status / RoHS Status
Compliant
Mechanical Characteristics
QSOP Package Dimensions
Thin Film on Silicon 2QSP / 2NBS -XX6 R2R Ladder
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MO-137.
(.150 - .157)
3.81 - 3.99
2QSP16
2QSP20
2QSP24
2QSP28
Model
0-8 °
PIN 1
(.053 - .069)
1.35 - 1.75
(.004 - .010)
.10 - .25
(.228 - .244)
5.80 - 6.20
4.80 - 4.98 (.189 - .196)
8.56 - 8.74 (.337 - .344)
8.56 - 8.74 (.337 - .344)
9.80 - 9.98 (.386 - .393)
(.025)
.635
A
(.008 - .012)
TYP.
.21 - .31
A
(.007 - .010)
(.016 - .050)
.41 - 1.27
.19 - .25
Narrow-Body SOIC Package Dimensions
Customers should verify actual device performance in their specific applications.
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MS-012.
(.150 - .157)
3.81 - 3.99
2NBS08
2NBS14
2NBS16
Model
PIN 1
0-8 °
(.053 - .069)
1.35 - 1.75
(.004 - .010)
.10 - .25
(.228 - .244)
Specifications are subject to change without notice.
4.80 - 4.98 (.189 - .196)
8.56 - 8.74 (.337 - .344)
9.80 - 9.98 (.386 - .393)
5.80 - 6.20
(.050)
(.014 - .018)
1.27
0.36 - 0.46
A
TYP.
A
(.007 - .010)
(.016 - .050)
.41 - 1.27
.19 - .25