BLM18HD471SN1J Murata, BLM18HD471SN1J Datasheet - Page 186

• Manufacturer Part Number: BLM18HD471SN1J
• Manufacturer: Murata

Specifications of BLM18HD471SN1J

• Lead Free Status / RoHS Status: Compliant

6
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
184
EMIFILr (Soldering and Mounting)
DLP
DLW
DLM
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Series
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
oCoat with solder paste to the following thickness:
*Solderability is subject to reflow conditions and
thermal conductivity. Please make sure that your
product has been evaluated in view of your
specifications with our product being mounted to your
product.
DLP0NS
DLP11S
DLP31S
DLM11G
DLP2AD/31D
DLP0NS/11S/31S/DLM11G
pattern printing. Use of Sn-Zn based solder will
deteriorate performance of products. If using
DLP/DLM series with Sn-Zn based solder, please
contact Murata in advance.
100-150 m: DLW21S/21H/31S,
150-200 m: DLP31D/31S, DLM2HG,
DLW5AH/5BS/5BT
Series
c
d
a
5.5
2.9
0.9
b
0.3
0.7
1.0
0.5
a
0.55
0.3
0.6
0.5
DLP0NS/11S/2AD
DLW5AH/5BS/5BT
a
b
Solder Paste Printing
0.3
0.3
0.7
0.4
c
0.55
0.5
2.1
0.7
d
DLW21S/H
DLW31S
DLP2AD
DLP31D
Series
Series
DLW21S/21H/31S
DLM2HG
a
b
0.55
1.0
a
0.8
1.6
a
0.4
0.8
b
2.6
3.7
1.0
4.0
b
0.25
0.4
0.5
0.4
c
c
0.5
0.8
1.2
1.6
d
d
DLP31S/DLM2HG
Apply 0.3mg of bonding agent at each chip.
Coating Position of
Bonding Agent
Coating Position of
Bonding Agent
DLP31D
Adhesive Application
Continued on the following page.
DLM2HG
Coating Position of
DLP31S
Bonding Agent
(in mm)
C31E.pdf
08.9.1