BLM18HB331SN1J Murata, BLM18HB331SN1J Datasheet - Page 179

• Manufacturer Part Number: BLM18HB331SN1J
• Manufacturer: Murata

Specifications of BLM18HB331SN1J

• Lead Free Status / RoHS Status: Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. Standard Land Pattern Dimensions
BLM02
BLM03
BLM15
BLM18
BLM21
BLM31
BLM41
(Except BLM
15A_AN series)
NFp series suppress noise by conducting the high-frequency noise element to ground. Therefore, to obtain maximum
performance from these filters, the ground pattern should be made as large as possible during the PCB design stage. As
shown below, one side of the PCB is used for chip mounting, and the other is used for grounding.
Small diameter feedthrough holes are then used to connect the grounds on each side of the PCB. This reduces the high-
frequency impedance of the grounding and maximizes the filter's performance.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
oReflow and Flow
BLM Series
Except BLM03PG/15PD·PG/18PG·KG·SG/21PG.
And BLM02/03/15/18G is specially adapted for reflow
soldering.
BLM02
BLM03
BLM15
BLM18
BLM21
Type
(except 18G)
Soldering
Reflow
Reflow
Reflow
Reflow
Reflow
Flow/
Flow
a
b
0.16-0.2
0.2-0.3
0.4
0.7
1.2
a
0.4-0.56
0.6-0.9
1.2-1.4
2.2-2.6
1.8-2.0
3.0-4.0
b
0.2-0.23
0.3
0.5
0.7
1.0
c
EMIFILr (Soldering and Mounting)
BLMppP/K/S
BLM03PG
BLM15PD
BLM15PG
BLM18PG
BLM18KG
BLM18SG
BLM21PG
BLM31PG
BLM41PG
Do not apply narrower pattern than listed above to BLMppP/K/S.
Narrow pattern can cause excessive heat or open circuit.
Type
Current
0.75-0.9
3-3.5
1.3-1.5
1.7-2.2
0.5-1.5
1.3-1.5
1.7-2.2
1.5/2
Rated
3-4
1-2
1.5
2.5
1.5
(A)
1
2
3
6
6
2
3
6
3
6
3
6
Soldering
Reflow
Reflow
Reflow
Reflow
Flow/
0.2-0.3
0.4
0.4
0.7
1.2
2.0
3.0
a
a
b
Continued on the following page.
0.6-0.9
1.2-1.4
1.2-1.4
2.2-2.6
Reflow
1.8-2.0
3.0-4.0
4.2-5.2
5.5-6.5
Flow
b
Land Pattern
+ Solder Resist
Land Pattern
Solder Resist
0.3
0.5
0.5
0.7
1.0
1.2
c
18 m 35 m 70 m
Land pad thickness
0.3
0.5
1.2
0.5
0.7
1.2
2.4
0.7
1.2
2.4
6.4
0.7
1.2
2.4
6.4
1.0
1.2
2.4
6.4
1.2
2.4
6.4
1.2
2.4
6.4
and dimension d
0.3
0.5
0.7
0.5
0.7
0.7
1.2
0.7
0.7
1.2
3.3
0.7
0.7
1.2
3.3
1.0
1.0
1.2
3.3
1.2
1.2
3.3
1.2
1.2
3.3
1.65
1.65
1.65
1.65
1.65
0.3
0.5
0.5
0.5
0.7
0.7
0.7
0.7
0.7
0.7
0.7
0.7
0.7
1.0
1.0
1.0
1.2
1.2
1.2
1.2
(in mm)
177
C31E.pdf
08.9.1
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