SFC2280-10.WCT Semtech, SFC2280-10.WCT Datasheet

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SFC2280-10.WCT

Manufacturer Part Number
SFC2280-10.WCT
Description
Manufacturer
Semtech
Type
EMI Filterr
Datasheet

Specifications of SFC2280-10.WCT

Mounting Style
Surface Mount
Termination
Flat Style
Operating Temp Range
-55C to 125C
Product Height (mm)
0.5mm
Lead Free Status / RoHS Status
Compliant
The SFC2280-10 is a low pass filter array with integrated
TVS diodes. It is designed to provide bidirectional
filtering of EMI/RFI signals and electrostatic discharge
(ESD) protection in portable electronic equipment. This
state-of-the-art device utilizes solid-state silicon-ava-
lanche technology for superior clamping performance
and DC electrical characteristics. They have been
optimized for use on a speaker port in cellular phones
and other protable electronics.
The device has very low insertion loss in the pass band
(to approximately 10MHz) and high attenuation at
frequencies ranging from 800MHz to 3GHz. Each line
features two stages of TVS diode protection. The TVS
diodes provide effective suppression of ESD voltages
in excess of ±15kV (air discharge) and ±8kV (contact
discharge) per IEC 61000-4-2, level 4. The TVS diodes
are bidirectional for supporting bipolar audio signals
without distortion.
The SFC2280-10 is a 6-bump, 0.5mm pitch flip chip
array with a 3x2 bump grid. It measures 1.5 x 1.0 x
0.65mm. This small outline makes the device espe-
cially well suited for portable applications. The flip chip
design results in lower inductance for optimized filter
and ESD clamping performance.
Revision 07/05/05
PROTECTION PRODUCTS
PROTECTION PRODUCTS
Description
Circuit Diagram (Each Line)
LOW PASS FILTER
Headset Speaker EMI and ESD Protection
1
Features
Mechanical Characteristics
Applications
Schematic & PIN Configuration
Flip Chip bidirectional EMI/RFI filter with
integrated ESD protection
ESD protection to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Filter performance: 20dB attenuation at 800MHz
Small chip scale package requires less board space
Low profile (< 0.65mm)
Bidirectional TVS to support negative voltages in
audio applications
Maximum Dimensions: 1.5 x 1.0 x 0.65 mm
TVS Working voltage: 5V
Series Resistor: 10
Solid-state technology
JEDEC MO-211, 0.50 mm Pitch Flip Chip Package
Non-conductive top side coating
Marking : Marking Code and orientation mark
Packaging : Tape and Reel
Cell Phone Handsets and Accessories
Personal Digital Assistants (PDA’s)
Notebook and Hand Held Computers
Digital Camcorders
MP3 Players
3 x 2 Grid CSP TVS (Bottom View)
SFC2280-10
ChipClamp
PRELIMINARY
www.semtech.com

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SFC2280-10.WCT Summary of contents

Page 1

... PROTECTION PRODUCTS PROTECTION PRODUCTS Description The SFC2280- low pass filter array with integrated TVS diodes designed to provide bidirectional filtering of EMI/RFI signals and electrostatic discharge (ESD) protection in portable electronic equipment. This state-of-the-art device utilizes solid-state silicon-ava- lanche technology for superior clamping performance and DC electrical characteristics ...

Page 2

... PROTECTION PRODUCTS Absolute Maximum Rating Electrical Characteristics 2005 Semtech Corp ° SFC2280-10 PRELIMINARY > > www.semtech.com µ ...

Page 3

... Peak Pulse Current - Ipp (A) ESD Clamping (15kV Air) 2005 Semtech Corp. CH1 S21 START. 030 MHz Line to Gnd Gnd to Line Waveform Parameters µ 20µ SFC2280-10 PRELIMINARY Analog Crosstalk (B1 to A3) LOG 20 dB/ REF 0 dB STOP 000.000000 MHz 3 ESD Clamping (8kV Contact) www.semtech.com ...

Page 4

... PROTECTION PRODUCTS Applications Information Device Connection Options The SFC2280-10 has solder bumps located matrix layout on the active side of the device. The bumps are designated by the numbers along the horizontal axis and letters along the vertical axis. The lines to be protected are connected at bumps A1, B1, A3, and B3 ...

Page 5

... IPC/JEDEC standard J-STD-020 for assembly of small body components. During reflow, the component will self-align itself on the pad. Assembly Guideline for Pb-Free Soldering The following are recommendations for the assembly of this device 2005 Semtech Corp " SFC2280-10 PRELIMINARY NSMD Package Footprint Stencil Design www.semtech.com ...

Page 6

... The evaluation board for the SFC2280-10 is shown in Figure 1. The board is specifically designed for fre- quency response analysis. The evaluation board contains SMA connectors at each of the circuits inputs and outputs ...

Page 7

... PROTECTION PRODUCTS Applications Information (Continued) Voltage Clamping Characteristics. The clamping characteristics of the SFC2280-10 are optimized by the use of two TVS diodes in the protec- tion circuit (Figure 3). An ESD strike on the protected line will be initially suppressed by the first TVS diode. The voltage across the TVS will be the clamping voltage ...

Page 8

... PROTECTION PRODUCTS Applications Information (Continued) SFC2280-10 SFC2280-68 Figure 4 - Cell Phone Headset Audio Port Protection 2005 Semtech Corp. To Audio Circuit To Audio Circuit 8 SFC2280-10 PRELIMINARY www.semtech.com ...

Page 9

... Land Pattern - 3x2 Grid Flip Chip 2005 Semtech Corp 1.47±0.03 INDEX AREA 0.97±0.03 A1 CORNER 0.10 C 0.40-0. 0.150±0.025 0.05 C 0.50 6X Ø0.175-0.225 B 0. NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS 2. REFERENCE JEDEC REGISTRATION MO-211. 3. Sn63/Pb37 FOR STANDARD DEVICES OR SN95.5/Ag3.8/Cu0.7 FOR Pb-FREE DEVICES 9 SFC2280-10 PRELIMINARY 0.50-0.75 0.005 www.semtech.com ...

Page 10

... Tape and Reel Specification Tape Specifications Contact Information 2005 Semtech Corp. Ordering Information Notes (1) Lead Free Solder Balls (2) Lead Free devices are RoHS/WEEE Compliant ChipClamp is a mark of Semtech Corporation Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 10 SFC2280-10 PRELIMINARY ...

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