B72660M250K72 EPCOS Inc, B72660M250K72 Datasheet - Page 26

• Manufacturer Part Number: B72660M250K72
• Manufacturer: EPCOS Inc

Specifications of B72660M250K72

• Technology: Metal Oxide
• Capacitance Value: 1400pF
• Clamping Current: 2.5A
• Clamping Voltage: 77V
• Ac Voltage Rating (max): 25VAC
• Dc Voltage Rating (max): 31VDC
• Operating Temp Range: -40C to 85C
• Mounting: Surface Mount
• Surge Current (max): 250A
• Size Code: 4032
• Product Length (mm): 10.2mm
• Product Depth (mm): 8mm
• Product Height (mm): 3.2mm
• Varistor Voltage: 39V
• Lead Free Status / RoHS Status: Compliant

A further advantage of adhesion is that the components are subjected to virtually no temperature
shock at all. The curing temperatures of the adhesives are between 120 C and 180 C, typical
curing times are between 30 minutes and one hour.
The bending strength of glued chips is, in comparison with that of soldered chips, higher by a fac-
tor of at least 2, as is to be expected due to the elasticity of the glued joints.
The lower conductivity of conductive adhesive may lead to higher contact resistance and thus re-
sult in electrical data different to those of soldered components. Users must pay special attention
to this in RF applications.
6
Test
Wettability
Leaching
resistance
Thermal shock
(solder shock)
Tests of resistance
to soldering heat
for SMDs
Tests of resistance
to soldering heat
for radial leaded
components
(SHCV)
Please read Cautions and warnings and
Important notes at the end of this document.
SMD disk varistors (CU varistors)
Standard series
Solderability tests
Standard
IEC
60068-2-58
IEC
60068-2-58
IEC
60068-2-58
IEC
60068-2-20
Test conditions
Sn-Pb soldering
Immersion in
60/40 SnPb solder
using non-activated
flux at 215
for 3
Immersion in
60/40 SnPb
solder using
mildly activated flux
without preheating
at 260
for 10 1 s
Dip soldering at
300 C/5 s
Immersion in
60/40 SnPb for 10 s
at 260 C
Immersion
of leads in
60/40 SnPb
for 10 s at 260 C
0.3 s
5 C
Page 26 of 35
3 C
Test conditions
Pb-free soldering
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
at 245
for 3
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
without preheating
at 255
for 10 1 s
Dip soldering at
300 C/5 s
Immersion in
Sn96.5Ag3.0Cu0.5
for 10 s at 260 C
Immersion
of leads in
Sn96.5Ag3.0Cu0.5
for 10 s at 260 C
0.3 s
5 C
5 C
Criteria/ test results
Covering of 95% of
end termination,
checked by visual
inspection
No leaching of
contacts
No deterioration of
electrical parameters.
Capacitance change:
Change of varistor
voltage:
Change of varistor
voltage:
Change of
capacitance X7R:
15%
5%
5/+10%
5%