PRF18AS471QS2RB Murata, PRF18AS471QS2RB Datasheet - Page 36

• Manufacturer Part Number: PRF18AS471QS2RB
• Manufacturer: Murata

Specifications of PRF18AS471QS2RB

• Lead Free Status / RoHS Status: Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
Allowable Flow Soldering Temp. and Time
Flow Soldering Conditions
(2) Adhesive Application and Curing
(4) Recommendable Temperature Profile for Soldering
(5) There may be a risk of unexpected failures
Continued from the preceding page.
(a) If insufficient adhesive is applied, or if the adhesive
(b) Too low viscosity of adhesive causes this product to
(a) Insufficient preheating may cause a crack on
(b) Rapid cooling by dipping in solvent or by other
(tombstone, insufficient solder-wetting, etc.) in the
mounting process caused by the mounting conditions.
Please make sure that this product is correctly mounted
under specified mounting conditions.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
200
100
is not sufficiently hardened, this product may have a
loose contact with the land, during flow soldering.
slip on board, after mounting.
ceramic body. Difference between preheating
temperature and maximum temperature in the profile
should be 100 C.
means is not recommended.
0
* In the event that soldering is repeated more than twice the
accumulated soldering time should be in the above allowable
soldering time (3).
Preheating: 150 10 C, 1-2 minutes.
Soldering: 240 C, 3 seconds max.
270
260
250
240
230
220
210
200
Preheating (in air)
0
1 to 2 min.
10
Time (sec.)
*3 sec.max.
Soldering
20
240 C
Gradual cooling
30
(in air)
For POSISTORr Chip Type !Caution/Notice
Allowable Reflow Soldering Temp. and Time
Reflow Soldering Conditions
(3) Allowable Soldering Temperature and Time
(a) Solder within the temperature and time
(b) The excessive soldering conditions may cause
(c) In the event that soldering is repeated more than
200
100
combinations, indicated by the slanted lines in the
following graphs.
dissolution of metallization or deterioration of solder-
wetting on the external electrode.
twice, the allowable reflow soldering time should be
the accumulated soldering time.
0
* In the event that soldering is repeated more than twice the
accumulated soldering time should be in the above allowable
soldering time (3).
Preheating: 150 10 C, 1-2 minutes.
Soldering: 240 C, 20 seconds max.
270
260
250
240
230
220
210
200
Preheating (in air)
0
10
1 to 2 min.
20
Time (sec.)
30
*20 sec.max.
Soldering
40
240 C
50
Gradual cooling
60
(in air)
R03E.pdf
35
07.3.21
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