60PI3150AA30J Kemet, 60PI3150AA30J Datasheet - Page 6
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60PI3150AA30J
Manufacturer Part Number
60PI3150AA30J
Description
Manufacturer
Kemet
Datasheet
1.60PI3150AA30J.pdf
(8 pages)
Specifications of 60PI3150AA30J
Tolerance (+ Or -)
5%
Voltage
630VDC/220VAC
Temp Coeff (dielectric)
PLYE
Mounting Style
Through Hole
Construction
Radial
Failure Rate
Not Required
Seated Plane Height
14.5mm
Product Diameter (mm)
Not Requiredmm
Product Height (mm)
14.5mm
Product Depth (mm)
8.5mm
Product Length (mm)
18mm
Lead Spacing (nom)
15mm
Lead Diameter (nom)
0.8mm
Operating Temp Range
-55C to 105C
Capacitance
.15uF
Package / Case
Not Required
Lead Free Status / RoHS Status
Compliant
eleCTRICAl ChARACTeRISTICS
Rated temperature (T
Temperature derated voltage:
for temperatures between +85°C and +125°C
a decreasing factor of 1.25% per degree °C on the rated
voltage V
Capacitance range:
Capacitance values:
e6 series (IeC 60063 Norm).
Capacitance tolerances (measured at 1 kHz):
Total self-inductance (L): (lead length ~2mm)
Dissipation factor (DF):
tg
Insulation resistance:
Test voltage between terminations:
1.6xV
09/2008
Rated voltage (V
-
δ
kHz
10
1
Test conditions
Temperature:
Voltage charge time:
Voltage charge:
Performance
For V
≥
≥
F
≥
≥
*Typical value
Pitch (mm)
10
3750 M
1250 s
30000 M
10000 s
or V
L(nH) ≈
R
-4
applied for 2 s at +25°C
at +25°C
R
R
≤100 Vdc
>100 Vdc
R
C≤1µF
Ω
(d.c. and a.c.) has to be applied.
≤100
≤150
Ω
for C
for C
for C
for C
10
R
±
9
): 050Vdc - 63Vdc -100Vdc - 160Vdc
5°C
250Vdc - 400Vdc - 630Vdc-1000Vdc .
R
):
≤
>
≤
>
0.33
0.33
0.33
0.33
±
C>1µF
15
10
≤100
5% (J);
+85°C
1000pF to 220
100 Vdc
50 Vdc
µ
µ
µ
µ
1 min
+25°C
F
F
F
F
22.5
18
±
(50000 M
(5000 s)*
(50000 M
(17000 s)*
5°C
±
10% (K);
±
5°C
for V
for V
27.5
18
µ
R
R
F
Ω
Ω
<
≥
)*
)*
100 Vdc
±
100 Vdc
20% (M).
37.5
22
46
MeTAllIZeD POlyeSTeR FIlM CAPACITOR
D.C. MulTIPuRPOSe APPlICATIONS
PRoDUCT CoDe: R60
TeST MeThOD AND PeRFORMANCe
Damp heat, steady state:
endurance:
Resistance to soldering heat:
long term stability (after two years):
RelIABIlITy:
Reference MIL HDB 217
Test conditions
Temperature:
Relative humidity (RH):
Test duration:
Performance
Capacitance change |∆C/C|:
DF change (∆tg
Insulation resistance:
Test conditions
Temperature:
Test duration:
Voltage applied:
Performance
Capacitance change |∆C/C|:
DF change (∆tg
Insulation resistance:
Test conditions
Solder bath temperature:
Dipping time (with heat screen):10 s
Performance
Capacitance change |∆C/C|:
DF change (∆tg
Insulation resistance:
Storage
Performance
Capacitance change |∆C/C|:
Application conditions:
Temperature:
Voltage:
Failure rate:
(1 FIT = 1x10
Failure criteria:
Short or open circuit
Capacitance change |∆C/C|: >10%
DF change (∆tg
Insulation resistance:
: standard environmental conditions (see page 12).
-9
failures/componentsxh)
δ
δ
δ
δ
):
):
):
):
≤
≤
≤
≤
50x10
30x10
50x10
30x10
+40°C
93%
56 days
≤
≤
≥
+105°C
2000 h
1.25xV
≤
≥
+260°C
≤
≥
≤
+40°C
0.5xV
≤
>2xinitial limit.
<0.005xinitial limit.
≤
-4
-4
-4
-4
5%
50x10
50% of initial limit.
5%
50% of initial limit.
2%
3% for C
5 FIT
2% for C
initial limit.
at 10kHz for C
at 01kHz for C
at 10kHz for C
at 01kHz for C
±
R
2%
±
±
±
C
-4
2°C
2°C
±
±
1 s
2°C
5°C
at 1kHz
≤
>
0.1
MKT Series
0.1
R60
µ
µ
F
F
≤
≤
>
>
1
1
1
1
µ
µ
µ
µ
F
F
F
F