ASDL-3007-021 Avago Technologies US Inc., ASDL-3007-021 Datasheet - Page 14

• Manufacturer Part Number: ASDL-3007-021
• Description: Infrared Transceivers SIR+RC transceiver
• Manufacturer: Avago Technologies US Inc.

Specifications of ASDL-3007-021

• Wavelength: 885 nm, 875 nm
• Continual Data Transmission: 115.2 Kbit/s
• Transmission Distance: 50 cm
• Radiant Intensity: 19 mW/sr
• Half Intensity Angle Degrees: 30 deg to 60 deg
• Pulse Width: 4 us, 1.6 us
• Maximum Rise Time: 60 ns, 600 ns
• Maximum Fall Time: 60 ns, 600 ns
• Led Supply Voltage: 5.5 V
• Maximum Forward Current: 32 mA
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 7 mm x 2.8 mm x 1.6 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Recommended Metal solder Stencil Aperture
It is recommended that a 0.127 mm (0.005 inch) thick
stencil be used for solder paste printing. This is to ensure
adequate printed solder paste volume and no shorting.
See the Table 1 below the drawing for combinations of
metal stencil aperture and metal stencil thickness that
should be used.
Aperture
Appendix A: ASDL-3007 SMT Assembly Application Note
Solder Pad, Mask and Metal Stencil
Figure A1. Stencil and PCBA
Recommended land pattern
Figure A2. Recommended Land Pattern
Figure A3. Solder stencil aperture
14
1.7
Stencil
Solder
0.10
Mask
0.50
MOUNTING
Land Dimensions
l
Apertures As Per
CENTER
0.35
0.425
0.85
w
Metal Stencil
For Solder
Paste Printing
Land
Pattern
PCBA
FIDUCIAL
+
0.75
t
Table 1
Adjacent Land Keepout and Solder Mask Areas
Adjacent land keepout is the maximum space occupied
by the unit relative to the land pattern. There should be
no other SMD components within this area. The minimum
solder resist strip width required to avoid solder bridging
adjacent pads is 0.25mm.It is recommended that two fi-
ducially crosses be placed at mid length of the pads for
unit alignment.
Note: Wet/Liquid Photo-imaginable solder resist/mask is recommended
Figure A4. Adjacent Land Keepout and Solder Mask Area
Dimension
h
l
k
j
Stencil thickness, t (mm)
h
0.127mm
SOLDER MASK
mm
0.25
1.5
.0
8.0
j
1.7+/-0.05
Length, l
Aperture size (mm)
UNITS: mm
0.5+/-0.05
Width, w
k
l