TFDU6301-TR1 Vishay, TFDU6301-TR1 Datasheet - Page 8

• Manufacturer Part Number: TFDU6301-TR1
• Description: Fiber Optic Transmitters, Receivers, Transceivers FIR 4Mbit/s 2.4-3.6V Op Voltage
• Manufacturer: Vishay

Specifications of TFDU6301-TR1

• Product: Transceiver
• Data Rate: 4 Mbps
• Wavelength: 886 nm
• Maximum Rise Time: 40 ns
• Maximum Fall Time: 40 ns
• Pulse Width Distortion: 2.2 us
• Operating Supply Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Package / Case: SMD-8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

TFDU6301
Vishay Semiconductors
RECOMMENDED SOLDER PROFILES
Solder Profile for Sn/Pb Soldering
Lead (Pb)-free, Recommended Solder Profile
The TFDU6301 is a lead (Pb)-free transceiver and qualified
for lead (Pb)-free processing. For lead (Pb)-free solder paste
like Sn
profiles: Ramp-Soak-Spike (RSS) and Ramp-To-Spike
(RTS). The Ramp-Soak-Spike profile was developed
primarily for reflow ovens heated by infrared radiation. With
widespread use of forced convection reflow ovens the
Ramp-To-Spike profile is used increasingly. Shown in
figure 6 and 7 are Vishay’s recommended profiles for use
with the TFDU6301 transceivers. For more details please
refer to the application note “SMD Assembly Instructions”.
A ramp-up rate less than 0.9 °C/s is not recommended.
Ramp-up rates faster than 1.3 °C/s could damage an optical
part because the thermal conductivity is less than compared
to a standard IC.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices wave
soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However,
recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless,
we added a chapter to the above mentioned application note,
describing manual soldering and desoldering.
Storage
The storage and drying processes for all Vishay transceivers
(TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels on the
packing and also in the application note “Taping, Labeling,
Storage and Packing”.
www.vishay.com
8
Fig. 5 - Recommended Solder Profile for Sn/Pb soldering
19535
260
240
220
200
180
160
140
120
100
(3.0 - 4.0)
80
60
40
20
0
0
for
Ag
2 to 4 °C/s
50
a
(0.5 - 0.9)
production
100
Cu, there are two standard reflow
[e-mail], [e-mail],
160 °C max.
240 °C max.
120 to180 s
150
Time/s
For technical questions within your region, please contact one of the following:
2 to 4 °C/s
process
200
Fast Infrared Transceiver Module (FIR, 4 Mbit/s)
90 s max.
10 s max. at 230 °C
250
for 2.4 V to 3.6 V Operation and Low-Voltage
it
300
cannot
350
be
Logic (1.8 V)
TFDU Fig3
19532
275
250
225
200
175
150
125
100
280
240
200
160
120
75
50
25
80
40
0
0
0
0
Fig. 6 - Solder Profile, RSS Recommendation
[e-mail]
2 °C/s to 3 °C/s
50
T ≥ 217 °C for 70 s max.
50
Fig. 7 - RTS Recommendation
T ≥ 255 °C for 10 s....30 s
T
100
peak
1.3 °C/s
100
90 s to 120 s
Peak temperature T
Time above 217 °C t ≤ 70 s
Time above 250 °C t ≤ 40 s
= 260 °C max.
150
Time/s
Time/s
150
200
Document Number: 84668
peak
70 s max.
200
30 s max.
< 4 °C/s
250
= 260 °C
Rev. 2.0, 18-Aug-09
T
< 2 °C/s
peak
2 °C/s to 4 °C/s
250
300
= 260 °C
300
350