HFBR-5963AL Avago Technologies US Inc., HFBR-5963AL Datasheet - Page 7

Fiber Optic Transmitters, Receivers, Transceivers OC3/FE 2X5 LC SD LVT TL EXTD TEMP

HFBR-5963AL

Manufacturer Part Number
HFBR-5963AL
Description
Fiber Optic Transmitters, Receivers, Transceivers OC3/FE 2X5 LC SD LVT TL EXTD TEMP
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HFBR-5963AL

Function
Transceivers for ATM, FDDI, Fast Ethernet and SONET OC-3/SDH STM-1 with LC connector.
Product
Transceiver
Data Rate
125 Mbps, 155 Mbps
Wavelength
1300 nm
Maximum Rise Time
3 ns, 2.2 ns
Maximum Fall Time
3 ns, 2.2 ns
Pulse Width Distortion
0.4 ns, 0.3 ns
Maximum Output Current
50 mA
Operating Supply Voltage
2.97 V to 3.63 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Package / Case
DIP-10 with Connector
Optical Fiber Type
TX/RX
Data Transfer Rate
155.52MBd
Optical Rise Time
3/2.2ns
Optical Fall Time
3/2.2ns
Jitter
0.4/0.3ns
Operating Temperature Classification
Industrial
Peak Wavelength
1308/1380nm
Package Type
DIP With Connector
Operating Supply Voltage (min)
2.97V
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.63V
Output Current
50mA
Operating Temp Range
-40C to 85C
Mounting
Snap Fit To Panel
Pin Count
10
For Use With
Multimode Glass
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HFBR-5963ALZ
Manufacturer:
AVAGO
Quantity:
3 200
Part Number:
HFBR-5963ALZ
Manufacturer:
Avago Technologies
Quantity:
135
Part Number:
HFBR-5963ALZ
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Electrostatic Discharge (ESD)
There are two design cases in which immunity to ESD
damage is important. The first case is during handling of
the transceiver prior to mounting it on the circuit board.
It is important to use normal ESD handling precautions
for ESD sensitive devices. These precautions include using
grounded wrist straps, work benches, and floor mats in
ESD controlled areas.
The second case to consider is static discharges to the ex-
terior of the equipment chassis containing the transceiver
parts. To the extent that the LC connector is exposed to
the outside of the equipment chassis it may be subject
to whatever ESD system level test criteria that the equip-
ment is intended to meet.
Figure 6. Recommended Board Layout Hole Pattern and Panel Mounting

4 x Ø
NOTES:
1. THIS PAGE DESCRIBES THE RECOMMENDED CIRCUIT BOARD
2. THE HATCHED AREAS ARE KEEP-OUT AREAS RESERVED FOR HOUSING
3. THIS DRAWING SHOWS EXTRA PIN HOLES FOR 2 x 6 PIN AND 2 x 10 PIN
4. HOLES FOR MOUNTING STUDS MUST NOT BE TIED TO SIGNAL GROUND
5. HOLES FOR HOUSING LEADS OPTIONAL AND NOT REQUIRED FOR HFBR-
6. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
(.525)
13.34
A
LAYOUT AND FRONT PANEL OPENINGS FOR SFF TRANSCEIVERS.
STANDOFFS. NO METAL TRACES ALLOWED IN KEEP-OUT AREAS.
TRANSCEIVERS. THESE EXTRA HOLES ARE NOT REQUIRED FOR
HFBR-5961L AND OTHER 2 x 5 PIN SFF MODULES.
BUT MAY BE TIED TO CHASSIS GROUND.
5984L. IF NEEDED IN FUTURE, THESE HOLES MUST BE TIED TO SIGNAL
GROUND.
(.055 ± .004)
1.40 ± .10
(.479)
12.16
SEE DETAIL B
20 x Ø
(NOTE 5)
(.039)
1.00
(.032 ± .004)
0.81 ± .10
(.140)
3.56
+ 1.50
- 0
(+.059)
(- .000)
(.620)
15.75
+ 0
- 0.75
(+.000)
(- .030)
5 4 3 2 1
6 7 8 9 10
(1.014)
25.75
(.600)
15.24
MIN. PITCH
9 X
(.180)
(.280)
(.350)
(.070)
7.11
8.89
4.57
1.78
(.299)
SEE NOTE 3
7.59
A
A
SEE DETAIL A
(.400)
10.16
(.600)
15.24
2 x Ø
(.560 ± .004)
14.22 ± .10
MIN. PITCH
(.055 ± .004)
1.40 ± .10
(NOTE 4)
.039
1
DETAIL B (4 x)
(.400 ± .004)
10.16 ± .10
Electromagnetic Interference (EMI)
Most equipment designs utilizing this high speed trans-
ceiver from Avago Technologies will be required to meet
the requirements of FCC in the United States, CENELEC
EN55022 (CISPR 22) in Europe and VCCI in Japan.
This product is suitable for use in designs ranging
from a desktop computer with a single transceiver to a
concentrator or switch product with a large number of
transceivers.
Immunity
Equipment utilizing these transceivers will be subject to
radio-frequency electromagnetic fields in some environ-
ments These transceivers have a high immunity to such
fields.
For additional information regarding EMI, susceptibility,
ESD and conducted noise testing procedures and results
refer to Application Note 1166: Minimizing Radiated Emis-
sions of High-Speed Data Communications Systems.
DETAIL A (3 x)
2 x Ø
(.236)
6
(.090)
(.118)
2.29
3
.071
1.8
MAX. (AREA FOR EYELET'S)
SECTION A - A
(.118)
3
TOP OF PCB

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