C1005X5R0J335K TDK Corporation, C1005X5R0J335K Datasheet
C1005X5R0J335K
Manufacturer Part Number
C1005X5R0J335K
Description
CHIP CAPACITOR
Manufacturer
TDK Corporation
Series
Cr
Specifications of C1005X5R0J335K
Rohs Compliant
YES
Capacitance
3.3µF
Voltage - Rated
6.3V
Tolerance
±10%
Temperature Coefficient
X5R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 85°C
Features
Low ESR
Applications
General Purpose
Package / Case
0402 (1005 Metric)
Size / Dimension
0.039" L x 0.020" W (1.00mm x 0.50mm)
Thickness
0.50mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
445-5946-2
1
the product characteristics/performance for the particular part number. For product specification information, please refer to TDK's
general product specification. Please note that this standard part is not designed or warranted to meet any specifications of any
intermediate or end user different from or in addition to the specifications set forth in TDK's general product specification. Note also
that this standard part has not been specially designed or manufactured for, nor is it intended or warranted for use in, or permitted to
be resold for, specialized applications such as aviation, medical, and/or governmental/military applications (collectively, “Excluded
Applications").
http://www.tdk.co.jp
http://www.component.tdk.com
This datasheet is to be used for reference purposes only and is subject to change by TDK without notice. It reflects an overview of
NO.
SYMBOL
(1)
(2)
(3)
(4)
(5)
(6)
(7)
-
-
-
-
-
-
W
G
T
B
L
Dielectric Withstanding (DWV)
Storage Temperature Range
Temperature Characteristic
Nominal Capacitance (pF)
Insulation Resistance (IR)
Capacitance Tolerance
Dissipation Factor (DF)
Packaging Information
TDK Series Name
Rated Voltage (V)
Dimensions (mm)
Quality Factor (Q)
Soldering Method
PHYSICAL DIMENSIONS
SEGMENT
C
(1)
1005
DIMENSIONS (mm)
(2)
0.25 +0.05,-0.10
0.50 ± 0.10
0.50 ± 0.10
1.00 ± 0.10
0.35 MIN.
TDK MLCC DATASHEET
5ºC to 40ºC @ 20~70% RH
X5R
-55°C to 85°C, ± 15%
Reflow/Soldering Iron
2.5 x Rated Voltage
(3)
Tape and Reel
151 MΩ Min.
3,300,000.0
10% Max.
DETAIL
C Series
1.0 x 0.5
± 10%
6.3
-
0J
(4)
NO.
(1)
(2)
(3)
(4)
(5)
VDC applied for 1~5s; Charge/discharge current ≤ 50mA
1st & 2nd digits are significant digits; 3rd is multiplier
335
Termination
(5)
Electrode
Apply rated voltage for 60 seconds at 25ºC
Dielectric
Soldering technique based on chip shape
NAME
MATERIAL SYSTEM
CLASS II; Conforms to EIA 198
1.0 ± 0.2 Vrms; 1kHz ± 10%
See below for dimensions
For General Applications
1
Conforms to IEC 384-9
6 Months maximum
COMMENTS
EIA 481 format
Class I only
K
(6)
DC
1
MATERIAL
Copper (Cu)
CLASS II
(7)
T
Nickel (Ni)
Nickel (Ni)
Tin (Sn)
BaTiO3
3
Rev. 05-11-10
2
4
5
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