B32923C3474K EPCOS Inc, B32923C3474K Datasheet - Page 12

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B32923C3474K

Manufacturer Part Number
B32923C3474K
Description
Film Cap 0,47UF 10% 305V MKP X2
Manufacturer
EPCOS Inc
Series
MKP B32923r
Datasheet

Specifications of B32923C3474K

Capacitance
0.47µF
Voltage - Ac
305V
Voltage - Dc
630V
Dielectric Material
Polypropylene, Metallized
Tolerance
±20%
Operating Temperature
-40°C ~ 125°C
Mounting Type
Through Hole
Package / Case
Radial
Size / Dimension
1.043" L x 0.335" W (26.50mm x 8.50mm)
Height
0.650" (16.50mm)
Termination
PC Pins
Lead Spacing
0.886" (22.50mm)
Features
EMI Suppression
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Esr (equivalent Series Resistance)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
495-4206

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3
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 C.
Caution:
Consult us first if you wish to embed uncoated types!
Please read Cautions and warnings and
Important notes at the end of this document.
Embedding of capacitors in finished assemblies
B32921C/D ... B32926C/D
X2 / 305 V AC
Page 12 of 18

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