02013J0R1PBSTR\500 AVX Corporation, 02013J0R1PBSTR\500 Datasheet - Page 16
![T&R / MICROWAVE](/photos/1/11/11142/accu-p_0201_sml.jpg)
02013J0R1PBSTR\500
Manufacturer Part Number
02013J0R1PBSTR\500
Description
T&R / MICROWAVE
Manufacturer
AVX Corporation
Series
Accu-P®r
Datasheet
1.0201YJ2R8BBWTR500.pdf
(20 pages)
Specifications of 02013J0R1PBSTR\500
Rohs Compliant
YES
Features
RF, High Q, Low Loss
Package / Case
0201 (0603 Metric)
Tolerance
±0.02pF
Capacitance
0.10pF
Voltage - Rated
25V
Mounting Type
Surface Mount
Height
0.011" (0.28mm)
Operating Temperature
-55°C ~ 125°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
1
Accu-F
Environmental / Mechanical Characteristics
ENVIRONMENTAL CHARACTERISTICS
MECHANICAL CHARACTERISTICS
QUALITY & RELIABILITY
Accu-P
and materials.
• ON-LINE PROCESS CONTROL
• FINAL QUALITY INSPECTION
20
Solderability
IEC-68-2-58
Leach Resistance
IEC-68-2-58
Adhesion
MIL-STD-202F Method 211A
Termination Bond Strength
IEC-68-2-21 Amend. 2
Robustness of Termination
IEC-68-2-21 Amend. 2
High Frequency Vibration
MIL-STD-202F Method 201A,
204D (Accu-P
Storage
Life (Endurance)
MIL-STD-202F Method 108A
Accelerated Damp
Heat Steady State
MIL-STD-202F Method 103B
Temperature Cycling
MIL-STD-202F Method 107E
MIL-STD-883D Method 1010.7
Resistance to Solder Heat
IEC-68-2-58
This program forms an integral part of the production cycle
and acts as a feedback system to regulate and control
production processes. The test procedures, which are
integrated into the production process, were developed
after long research work and are based on the highly
developed semiconductor industry test procedures and
equipment. These measures help AVX to produce a con-
sistent and high yield line of products.
Finished parts are tested for standard electrical parameters
and visual/mechanical characteristics. Each production lot
is 100% evaluated for: capacitance and proof voltage at
2.5 U
®
R
. In addition, production is periodically evaluated for:
is based on well established thin-film technology
TEST
TEST
®
only)
®
/ Accu-P
D = 3mm Accu-P
D = 1mm Accu-F
125°C, 2U
85°C, 85% RH, U
-55°C to +125°C, 15 cycles – Accu-P
-55°C to +125°C, 5 cycles – Accu-F
260°C ± 5°C for 10 secs
Components completely immersed in a
solder bath at 235°C for 2 secs.
Components completely immersed in a
solder bath at 260±5°C for 60 secs.
A force of 5N applied for 10 secs.
Tested as shown in diagram
A force of 5N applied for 10 secs.
55Hz to 2000Hz, 20G
12 months minimum with components
stored in “as received” packaging
R
,1000 hours
CONDITIONS
CONDITIONS
®
D
R
, 1000 hours
45mm
QUALITY ASSURANCE
45mm
The reliability of these thin-film chip capacitors has been
studied intensively for several years. Various measures
have been taken to obtain the high reliability required today
by the industry. Quality assurance policy is based on well
established international industry standards. The reliability
of the capacitors is determined by accelerated testing
under the following conditions:
®
Average capacitance with histogram printout for
capacitance distribution;
IR and Breakdown Voltage distribution;
Temperature Coefficient;
Solderability;
Dimensional, mechanical and temperature stability.
Life (Endurance)
Accelerated Damp
Heat Steady State
®
No visible damage
∅ C/C ≤ 2% for C≥5pF
∅ C ≤ 0.25pF for C<5pF
No visible damage
∅ C/C ≤ 2% for C≥5pF
∅ C ≤ 0.25pF for C<5pF
No visible damage
∅ C/C ≤ 2% for C≥5pF
∅ C ≤ 0.25pF for C<5pF
C remains within initial limits
Terminations to be well tinned, minimum 95%
coverage
Dissolution of termination faces ≤15% of area
Dissolution of termination edges ≤25% of length
No visible damage
No visible damage
∅ C/C ≤ 2% for C≥5pF
∅ C ≤ 0.25pF for C<5pF
No visible damage
No visible damage
Good solderability
REQUIREMENT
REQUIREMENT
125°C, 2U
85°C, 85% RH, U
1000 hours.
R
, 1000 hours
R
,