RE0603DR-07150RL Yageo, RE0603DR-07150RL Datasheet - Page 6

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RE0603DR-07150RL

Manufacturer Part Number
RE0603DR-07150RL
Description
RESISTOR, 0603, 150R, 0,5%
Manufacturer
Yageo
Datasheet

Specifications of RE0603DR-07150RL

Rohs Compliant
YES
TESTS AND REQUIREMENTS
TEST
Life/
Endurance
High
Temperature
Exposure
Moisture
Resistance
Thermal
Shock
Short Time
Overload
Board Flex/
Bending
Solderability
-Leaching
-Resistance
to Soldering
Heat
- Wetting
Chip Resistor Surface Mount
TEST METHOD
MIL-STD-202G Method 108A
IEC 60115-1 4.25.1
MIL-STD-202G Method 108A
IEC 60115-1 4.25.3
MIL-STD-202G Method 106F
IEC 60115-1 4.24.2
MIL-STD-202G Method 107G
IEC 60115-1 4.13
IEC 60115-1 4.33
IPC/JEDECJ-STD-002B test
B
IEC 60068-2-58
IPC/JEDECJ-STD-002B test
D
IEC 60068-2-58
MIL-STD-202F Method 210F
IEC 60068-2-58
RE
PROCEDURE
At 70±5℃ for 1,000 hours; RCWV applied for 1.5
hours on and 0.5 hour off, still air required
1,000 hours at 155±5 ° C,unpowered
Each temperature / humidity cycle is defined at
8 hours (method 106F), 3 cycles / 24 hours for
10d with 25 ° C / 65 ° C 95% R.H, without steps
7a & 7b, unpowered
Parts mounted on test-boards, without
condensation on parts
-55/+125℃
Note Number of cycles required is 300 Devices
unmounted
Maximum transfer time is 20 seconds Dwell
time is 15 minutes. Air - Air
2.5 times RCWV or maximum overload voltage
which is less for 5 seconds at room
temperature
Device mounted or as described only 1 board
bending required
5 mm bending time: 60±5 seconds
Electrical Test not required Magnification 50X
SMD conditions:
1st step: method B, aging 4 hours at 155 ° C
dry heat
2nd step: leadfree solder bath at 245±3 ° C
Dipping time: 3±0.5 seconds
Leadfree solder ,260° C, 30 seconds
immersion time
Condition B, no pre-heat of samples
Leadfree solder, 260 ° C ±5℃, 10 ±1 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
SERIES
0402 to 1206
(RoHS Compliant & Halogen Free)
±(3%+0.05 )
REQUIREMENT
±(3%+0.05 )
±(3%+0.05 )
±(1%+0.05Ω)
±(1%+0.05Ω)
No visible damage
±(1%+0.05Ω)
No visible damage
Well tinned (>95%
covered)
No visible damage
No visible damage
±(1%+0.05Ω)
No visible damage
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