Y1624500R000T9R Vishay, Y1624500R000T9R Datasheet - Page 3

• Manufacturer Part Number: Y1624500R000T9R
• Description: RESISTOR, METAL FOIL, 500OHM 200mW, 0.01%
• Manufacturer: Vishay
• Series: VSMPr

Specifications of Y1624500R000T9R

• Resistance: 500ohm
• Resistance Tolerance: ± 0.01%
• Power Rating: 200mW
• Voltage Rating: 10V
• Resistor Element Material: Metal Film
• Temperature Coefficient: ± 0.2ppm/°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

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3
VSMP Series (0805, 1206, 1506, 2010, 2512)
Vishay Foil Resistors
Example:
VSMP0805 10k000 TCR0.2 TSW
Model: VSMP0805
Value: 10KΩ
TCR0.2: 0.2 ppm/°C typical refers to any value in the resistance range (see table 1)
Tolerance: ± 0.01%
Termination: Lead (Pb)-Free
Packaging: Waffle Pack
SALES
Note: The TCR for values < 100Ω are influenced by the termination composition and result in deviation from this curve.
MODEL
• GERMANY/CZECH REPUBLIC/AUSTRIA: [e-mail]
FIGURE 3 - TYPICAL TCR CURVE Z-FOIL (For more details, see Table 1)
TABLE 6 - ORDERING INFORMATION
VSMP
FIGURE 1 - POWER DERATING CURVE
• AMERICAS: [e-mail]
125
100
75
50
25
CHIP
0
SIZE
0805
1206
1506
2010
2512
-75
–55°C
–50
For technical questions in Asia/Japan/Europe/Africa/Israel, contact: [e-mail]
–25
1KΩ to 150KΩ
RESISTANCE
10Ω to < 1KΩ
RANGE
Ambient Temperature (°C)
0
+25
For technical questions in the Americas, contact: [e-mail]
(ppm)
Example: 10K000 = 10.0KΩ
Example: 249R00 = 249Ω
ΔR
RESISTANCE VALUE
R
+50
+ 150
+ 100
- 100
- 150
- 200
TCR of ± 0.2 ppm/°C and Load Life Stability of ± 0.005%
+ 50
+70°C
- 50
DESIGNATOR
Z Foil Wrap Around Surface Mount Chip Resistor with
0
+75
- 55
LETTER
- 50
Rated Power
R
+100 +125 +150 +175
K
- 25
• ASIA/JAPAN: [e-mail]
MULTIPLIER
FACTOR
0
Ambient Temperature (°C)
• FRANCE/SWITZERLAND/SOUTHERN EUROPE: [e-mail]
X 10
X 1.0
3
+ 25
+ 50
TCR0.2
TCR
+ 75
FIGURE 2 - RECOMMENDED MOUNTING
+ 100
TOLERANCE
Q = 0.02%
T = 0.01%
A = 0.05%
B = 0.1%
C = 0.25%
D = 0.5%
F = 1.0%
+ 125
± 0.2 ppm/°C (+25°C reference)
• UK/HOLLAND/SCANDINAVIA: [e-mail]
S = Lead (Pb)-Free
B = Tin/Lead
25% to 85% of T
TERMINATION
A low profile solder fillet is
recommended to avoid unnecessary
stresses along top edge of
metallization. IR and vapor phase
reflow are best. Avoid the use of
cleaning agents which could attack
epoxy resins, which form part of the
resistor construction.
• ISRAEL: [e-mail]
Document Number: 63060
Revision: 26-Sep-05
T = Tape and Reel
W = Waffle Pack
PACKAGING