L0805150JESTR AVX Corporation, L0805150JESTR Datasheet - Page 5

• Manufacturer Part Number: L0805150JESTR
• Description: HF INDUCTOR, 15NH, 300MA 5% 2500MHZ
• Manufacturer: AVX Corporation
• Series: Accu-Lr

Specifications of L0805150JESTR

• Inductance: 15nH
• Inductance Tolerance: ± 5%
• Dc Resistance Max: 0.6ohm
• Dc Current Rating: 300mA
• Self Resonant Frequency: 2.5GHz
• Q Factor: 28
• Inductor Case Style: 0805
• No. Of Pins: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

2
Accu-L
Application Notes
HANDLING
SMD chips should be handled with care to avoid dam age or
contamination from perspiration and skin oils. The use of
plastic tipped tweezers or vacuum pick-ups is strongly
recommended for individual components. Bulk handling
should ensure that abrasion and mechanical shock are min-
imized. For automatic equipment, taped and reeled product
is the ideal medium for direct presentation to the placement
machine.
CIRCUIT BOARD TYPE
All flexible types of circuit boards may be used (e.g. FR-4,
G-10) and also alumina.
For other circuit board materials, please consult factory.
COMPONENT PAD DESIGN
Component pads must be designed to achieve good joints
and minimize component movement during sol der ing.
Pad designs are given below for both wave and reflow
soldering.
The basis of these designs is:
WAVE SOLDERING
DIMENSIONS:
REFLOW SOLDERING
DIMENSIONS:
32
32
a. Pad width equal to component width. It is per mis si ble
b. Pad overlap about 0.3mm.
c. Pad extension about 0.3mm for reflow.
(0.091)
2.3
(0.122)
to decrease this to as low as 85% of component width
but it is not advisable to go be low this.
Pad ex ten sion about 0.8mm for wave soldering.
3.1
(0.035)
(0.020)
(0.035)
0.90
0.50
0.90
(0.051)
(0.020)
(0.051)
1.30
0.50
1.30
(0.031)
0.8
(0.031)
0.8
Accu-L
®
Accu-L
millimeters (inches)
millimeters (inches)
0603
0603
0805
®
®
(0.110)
(0.150)
2.8
3.8
(0.028)
(0.055)
(0.028)
(0.047)
(0.055)
(0.047)
0.7
1.4
0.7
1.2
1.4
1.2
(0.059)
(0.059)
1.5
1.5
Accu-L
Accu-L
0805
0805
®
®
PREHEAT & SOLDERING
The rate of preheat in production should not exceed
4°C/second. It is recommended not to exceed 2°C/
sec ond.
Temperature differential from preheat to soldering should not
exceed 150°C.
For further specific application or process advice, please
consult AVX.
HAND SOLDERING & REWORK
Hand soldering is permissible. Preheat of the PCB to 100°C
is required. The most preferable technique is to use hot air
soldering tools. Where a soldering iron is used, a tem per a -
ture controlled model not exceeding 30 watts should be
used and set to not more than 260°C. Max i mum al lowed
time at temperature is 1 minute. When hand sol der ing, the
base side (white side) must be sol dered to the board.
COOLING
After soldering, the assembly should preferably be al lowed to
cool naturally. In the event of assisted cool ing, similar condi-
tions to those rec om mend ed for pre heat ing should be used.
CLEANING RECOMMENDATIONS
Care should be taken to ensure that the devices are thor -
ough ly cleaned of flux residues, especially the space be neath
the device. Such residues may otherwise be come conduc-
tive and effectively offer a lossy bypass to the de vice. Various
recommended cleaning conditions (which must be optimized
for the flux system being used) are as follows:
STORAGE CONDITIONS
Recommended storage conditions for Accu-L
are as follows:
RECOMMENDED SOLDERING
PROFILE
For recommended soldering profile see page 23
Cleaning liquids . . . . . . i-propanol, ethanol, acetylace-
Ultrasonic conditions . . power – 20w/liter max.
Temperature . . . . . . . . . 80°C maximum (if not oth er wise
Time. . . . . . . . . . . . . . . 5 minutes max.
Temperature. . . . . . . . . 15°C to 35°C
Humidity . . . . . . . . . . . ≤65%
Air Pressure . . . . . . . . . 860mbar to 1060mbar
tone, water, and other standard
PCB cleaning liquids.
frequency – 20kHz to 45kHz.
limited by chosen sol vent system).
®
prior to use