MPZ2012S300AT000 TDK Corporation, MPZ2012S300AT000 Datasheet
MPZ2012S300AT000
Manufacturer Part Number
MPZ2012S300AT000
Description
CHIP INDUCTOR, 5A, 25%
Manufacturer
TDK Corporation
Series
MPZr
Datasheet
1.MPZ2012S331AT000.pdf
(2 pages)
Specifications of MPZ2012S300AT000
Dc Resistance Max
10mohm
Dc Current Rating
5A
Inductor Case Style
2012
No. Of Pins
2
Inductance Tolerance
± 25%
Core Material
Ferrite
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPZ2012S300AT000
Manufacturer:
agilent
Quantity:
30 150
Part Number:
MPZ2012S300AT000
Manufacturer:
TDK/东电化
Quantity:
20 000
Chip Beads(SMD)
For Power Line
MPZ Series MPZ2012 Type
FEATURES
• The MPZ series are multilayer chip impeders for power supply
• High miniaturized, these parts nonetheless exhibit low DC
• The products contain no lead and also support lead-free
• It is a product conforming to RoHS directive.
APPLICATIONS
Noise elimination of DC power supply lines for USB interface
circuitry, personal computers, electronic games, hard disk drives,
and other general electronic equipment.
Also effective as a noise countermeasure in signal lines.
PRODUCT IDENTIFICATION
(1)Series name
(2)Dimensions L× W
(3)Material code
(4)Nominal impedance
(5)Characteristic type
(6)Packaging style
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
• Please contact our Sales office when your application are considered the following:
• All specifications are subject to change without notice.
MPZ 2012 S 331 A T
250 to 260˚C
230˚C
180˚C
150˚C
(1)
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
line applications.
resistance and high current handling capability.
soldering.
331: 330Ω at 100MHz
T: Taping
(2) (3) (4) (5) (6)
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
10s max.
Natural
cooling
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
TEMPERATURE RANGES
Operating/storage
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
• After mounting components onto the printed circuit board, do not
• The inductance value may change due to magnetic saturation if
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
apply stress through board bending or mishandling.
the current exceeds the rated maximum.
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
2+0.3, –0.1
0.5±0.3
1.3
–55 to +125°C
Quantity
4000 pieces/reel
1
1.3
004-03 / 20061022 / e9413_mpz.fm
Conformity to RoHS Directive
Weight: 8mg
Dimensions in mm
(1/2)
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MPZ2012S300AT000 Summary of contents
Page 1
Chip Beads(SMD) For Power Line MPZ Series MPZ2012 Type FEATURES • The MPZ series are multilayer chip impeders for power supply line applications. • High miniaturized, these parts nonetheless exhibit low DC resistance and high current handling capability. • The ...
Page 2
ELECTRICAL CHARACTERISTICS Impedance DC resistance Part No. ∗1 (Ω)[100MHz] (Ω)max. MPZ2012S300A 30±10Ω 0.01 MPZ2012S101A 100±25% 0.02 MPZ2012S221A 220±25% 0.04 MPZ2012S331A 330±25% 0.05 MPZ2012S601A 600±25% 0.1 ∗1 : Test equipment E4991A or equivalent : Test tool 16192A or equivalent ∗2 Please ...