MPZ1608S221ATA00 TDK Corporation, MPZ1608S221ATA00 Datasheet
MPZ1608S221ATA00
Manufacturer Part Number
MPZ1608S221ATA00
Description
CHIP INDUCTOR, 2A, 25%
Manufacturer
TDK Corporation
Series
MPZr
Datasheet
1.MPZ1608S221ATA00.pdf
(3 pages)
Specifications of MPZ1608S221ATA00
Dc Resistance Max
50mohm
Dc Current Rating
2A
Inductor Case Style
1608
No. Of Pins
2
Inductance Tolerance
± 25%
Core Material
Ferrite
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPZ1608S221ATA00
Manufacturer:
TDK/东电化
Quantity:
20 000
Chip Beads(SMD)
For Power Line
MPZ Series MPZ1608 Type
TDK has manufactured MPZ2012 type as EMI countermeasure
product for power line, and now maximizes impedance to 600Ω (at
100MHz) and rated current to 1A, while minimizes Rdc under
150mΩ as 1608 type.
FEATURES
• This type is the best for energy-saving in the low DC resistance.
• The products contain no lead and also support lead-free
• It is a product conforming to RoHS directive.
APPLICATIONS
Noise suppression of personal computers, USB/IEEE1394
interfaces, HDDs, CD-ROMs, DVDs, DSCs, LCD panels, cellular
phones, etc.
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L× W
(3) Material code
(4) Nominal impedance
(5) Characteristic type
(6) Packaging style
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
• Please contact our Sales office when your application are considered the following:
• All specifications are subject to change without notice.
MPZ 1608 S 221 A T
250 to 260˚C
230˚C
180˚C
150˚C
(1)
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
soldering.
221: 220Ω at 100MHz
T: Taping
(2) (3) (4) (5) (6)
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
10s max.
Natural
cooling
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
Thickness(T)
0.6±0.15mm
0.8±0.15mm
TEMPERATURE RANGES
Operating/storage
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
• After mounting components onto the printed circuit board, do not
• The inductance value may change due to magnetic saturation if
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
apply stress through board bending or mishandling.
the current exceeds the rated maximum.
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
0.3±0.2
1.6±0.15
0.3±0.2
Weight
3mg
4mg
–55 to +125°C
Quantity
4000 pieces/reel
0.6
0.8
005-04 / 20061023 / e9413_mpz1608.fm
0.6
Conformity to RoHS Directive
Dimensions in mm
(1/3)
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MPZ1608S221ATA00 Summary of contents
Page 1
Chip Beads(SMD) For Power Line MPZ Series MPZ1608 Type TDK has manufactured MPZ2012 type as EMI countermeasure product for power line, and now maximizes impedance to 600Ω (at 100MHz) and rated current to 1A, while minimizes Rdc under 150mΩ as ...
Page 2
ELECTRICAL CHARACTERISTICS Impedance DC resistance Part No. ∗1 (Ω)[100MHz] (Ω)max. MPZ1608S300A 30±10Ω 0.01 MPZ1608S600A 60±25% 0.02 MPZ1608S101A 100±25% 0.03 MPZ1608S221A 220±25% 0.05 MPZ1608R391A 390±25% 0.12 MPZ1608S601A 600±25% 0.15 MPZ1608Y600B 60±25% 0.03 MPZ1608Y101B 100±25% 0.05 MPZ1608Y151B 150±25% 0.07 MPZ1608D300B 30±10Ω 0.07 ...
Page 3
TYPICAL ELECTRICAL CHARACTERISTICS vs. FREQUENCY CHARACTERISTICS MPZ1608D300B 250 200 150 Z R 100 100 1000 10000 Frequency ( MHz ) PACKAGING STYLES REEL DIMENSIONS 1.0 2.0±0.5 ø13±0.5 ø21±0.8 ø178±2.0 TAPE DIMENSIONS +0.1 ...