EXC28BB221U Panasonic, EXC28BB221U Datasheet - Page 4

• Manufacturer Part Number: EXC28BB221U
• Description: FERRITE CHIP BEAD, 100mA, 25%
• Manufacturer: Panasonic
• Series: EXC28Br

Specifications of EXC28BB221U

• Impedance: 220ohm
• Dc Resistance Max: 700mohm
• Dc Current Rating: 100mA
• Ferrite Mounting: SMD
• Ferrite Case Style: SSOP
• Reel Quantity: 5000
• Termination Type: SMD
• Test Frequency: 100MHz
• Rohs Compliant: Yes
• Filter Terminals: SMD
• Package / Case: 0804
• Resistance: 0.7ohm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

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Recommendations and precautions are described below.
<Repair with hand soldering>
● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
● Never touch this product with the tip of a soldering iron.
The following are precautions for individual products. Please also re fer to the precautions common to EMI Filters,
Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog.
1. When possible, do not mount Chip Bead Array (hereafter called the bead arrays) by fl ow soldering. It is highly
2. Use rosin-based fl ux or halogen-free fl ux.
3. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person
4. Do not apply shock to the bead arrays or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, their bodies
5. Store the bead arrays in a location with a temperature ranging from –5 °C to +40 °C and a relative humidity of 40 % to
6. Use the bead arrays within half a year after the date of the out go ing inspection indicated on the packages.
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Recommended Land Pattern Design
Recommended Soldering Conditions
● Please contact us for additional information when used in conditions other than those specifi ed.
● Please measure the temperature of the terminals and study every kind of solder and printed circuit board
each electrode for 3 seconds or less.
possible that fl ow soldering may cause bridges between the electrodes.
in advance.
may be chipped, affecting their performance. Excessive mechanical stress may damage the bead arrays. Handle
with care.
60 %, where there are no rapid changes in temperature or humidity.
Safety Precautions
for solderability before actual use.
<Recommended reflow soldering temperature>
✽ Refl ow soldering shall be performed a maximum of two times.
(Sn-3Ag-0.5Cu)
For soldering
Rising temperature I
For lead-free
(Sn-37Pb)
soldering
Solder
E
F
Rising temperature I
The normal time
The normal time
for preheating
for preheating
Preheating
30 s to 60 s
30 s to 60 s
E
Time (min.)
Rising temperature II
B
F
E
F
140 °C to 160 °C
150 °C to 170 °C
E
60 s to 120 s
60 s to 120 s
Preheating
heating
Main
Rising temperature II
Preheating to 200 °C
Preheating to 210 °C
Gradual
cooling
20 s to 40 s
20 s to 40 s
270
260
250
240
230
220
210
200
Main heating
235±10 °C
0
250
Dimension (mm)
C
D
A
B
E
F
Peak
Peak
10
+10
– 5
to reflow soldering heat
The limit of resistance
°C
20
1.75
0.25
0.25
1.4
0.4
0.5
30
Time (s)
200 °C to 100 °C
210 °C to 100 °C
Gradual cooling
1 °C to 4 °C/s
1 °C to 4 °C/s
Chip Bead Array
40
50
60
70
Feb. 2006