ZX80-B-5S HRS (HIROSE), ZX80-B-5S Datasheet - Page 20

• Manufacturer Part Number: ZX80-B-5S
• Description: PLUG, MICRO USB, B, PCB
• Manufacturer: HRS (HIROSE)

Specifications of ZX80-B-5S

• Connector Type: Gender
• No. Of Contacts: 5
• Contact Termination: Through Hole
• Connector Mounting: RoHS Compliant
• Colour: Black
• Contact Plating: Gold
• Contact Material: Copper Alloy
• Gender: Plug
• Svhc: No SVHC (15-Dec-2010)
• Rohs Compliant: Yes

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
20
ZX Series●Micro-USB connectors meeting requirements of USB 2.0 Standard
B
●
B
●
B
1. Exercise care when handling the connectors. Do not subject them to excessive external forces when mating/un-mating.
2. Mate and un-mate as intended, holding by the overmolded body, in the correct direction. Do not un-mate by pulling on the cable.
3. Some tooling marks may be visible on the surfaces of receptacle (shell/cover). No form/fit or function is affected.
4. Appearance of the surface finishes on the receptacles may vary between production runs. No affect on form, fit or function.
Embossed carrier tape dimensions
Using lead-free solder paste
Packaging Specifications
Recommended Temperature Profile - Receptacles
Precautions
250
200
150
100
(ç)
50
ZX62-AB-5PA
ZX62M-B-5P
ZX62-B-5PA
Part Number
180ç
150ç
Other
4
2
The contents of this catalog are current as of date of 07/2008. Contents are subject to change without notice for the purpose of improvements.
1.8
120 S
0.5
12
A dimension
220çmin.
®
250ç
24
24
24
16
Unreeling direction
B dimension
70 S
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11.5
11.5
11.5
7.5
(S)
●
Reel Dimensions
Note : Tape and reel packaging (2,000 pieces/reel).
Order by number of reels.
HRS test condition
Solder composition :Paste,96.5%Sn/3.0%Ag/0.5%Cu
Test board :Glass epoxy 35mm∞35mm∞0.8mm thick
The temperature profile is based on the left conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and
board size/thickness. Contact your solder paste and
equipment manufacturer for specific recommendations.
Note 1: Up to 2 cycles of Reflow soldering are possible
Note 2: The temperature profile indicates the board surface
ZX62-AB-5PA
ZX62M-B-5P
Part Number
ZX62-B-5PA
Other
under the same conditions, provided that there is a
return to normal temperature between the first and
second cycle.
temperature at the point of contacts with the
connector terminals.
C dimension
Unreeling direction
30.4
30.4
30.4
22.4
D dimension
24.4
24.4
24.4
16.4
C
D