M293321 Loctite, M293321 Datasheet - Page 2

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M293321

Manufacturer Part Number
M293321
Description
FLUX REMOVER, PEN
Manufacturer
Loctite
Datasheet
1.M293321.pdf (5 pages)

Specifications of M293321

Cleaner Type
Flux Remover
Dispensing Method
Pen Applicator
Peak Reflow Compatible (260 C)
No
Trade Name, Chemical
Prozone Cleaner
Leaded Process Compatible
No
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Item number
M00501
M00502
Item number
M00486
M00487
M00508
Item number
M00439
M00440
M00441
M00447
M00505
M00449
Item number
M00086
M00219
wide range of surface finishes, and an exceptional reflow process window.
good abandon time, long stencil life, and minimal hot slump. It has excellent
alloys. High temperature tolerance and wide printing capability. 96SC alloy
Multicore
wetting to a wide range of surface finishes. The activity of CR36 gives it an
exceptional reflow process window, making it suitable for both volume and
removed with DI water, without the need for a saponifier. WS200 has good
capabilities. High activity of the MP200 flux offers excellent wetting to a
A high activity, soft, colorless, low residue, no-clean solder paste that
Is suitable for fine pitch, high speed printing applications. Pin testable.
A high activity, colorless residue, no-clean solder paste. CR36 exhibits
exhibits excellent print definition with long open and abandon time
High performance water washable solder paste. Residues are readily
MP200 Solder Paste
CR36 No-Clean Solder Paste
open time with excellent print definition and soldering activity.
A no-clean flux system specially formulated for Pb-free
(Sn 95.5, Ag 3.5, Cu 0.7%) reflows at 217°C.
LF320 Lead Free Paste
WS200 Water Wash Paste
D
D
D
D
®
Product Description
96SC LF320 AGS88
96SC LF320 AGS88
Product Description
Sn63 WS200 AGS 90.5
Sn63 WS200 AGS 90.5
Sn63 WS200 AGS 90.5
high mix manufacturing.
Product Description
Sn63 MP200 AGS 90
Sn63 MP200 AGS 90
Sn63 MP200 AGS 90
Sn63 MP200 AGS 90
Sn63 MP200 AGS 90.5
Multi-Tak MP 200
(Rework Flux)
Product Description
Sn63 CR36 AGS 89.5
Sn63 CR36 AGS 89.5
ESCRIPTION
ESCRIPTION
ESCRIPTION
ESCRIPTION
Solder Pastes
/A
/A
/A
/A
PPLICATION
PPLICATION
PPLICATION
PPLICATION
Wide Process Window
Highest Activity Offering
Wide Process Window
Package size
500 Gram Jar
600 Gram Semco
Package size
500 Gram Jar
700 Gram Semco
1300 Gram Semco
Package size
500 Gram Jar
700 Gram Semco
1300 Gram Semco
20CC EFD Cartridge
750 Gram Proflow
30CC Cartridge
Package size
500 Gram Jar
500 Gram Semco
SN62/SN63
(Anti-Tombstoning)
A
LLOY
SN62/SN63
SN62/SN63
A
A
A
63S4
96SC
LLOY
LLOY
LLOY
21
% M
Item number
M00443
M00444
M00445
M00448
M00506
M00479
M00480
M00481
Item number
M00488
M00489
M00509
ETAL
89.5
L
OAD
% M
% M
% M
ETAL
ETAL
ETAL
90.5
90.5
90
88
(
L
L
L
G
1.3 - 1.6
OAD
OAD
OAD
T
./
ACK
MM
2
)
Product Description
Sn62 WS200 AGS 90.5
Sn62 WS200 AGS 90.5
Sn62 WS200 AGS 90.5
Product Description
Sn62 MP200 AGS 90
Sn62 MP200 AGS 90
Sn62 MP200 AGS 90
Sn62 MP200 AGS 90
Sn62 MP200 AGS 90.5
63S4 MP200 ACP 90
63S4 MP200 ACP 90
63S4 MP200 ACP 90
(
(
(
G
G
G
T
P
T
T
./
./
./
1.1
mm/sec .
1.2
0.8
ACK
ACK
ACK
RINT
MM
MM
MM
20 - 200
2
2
2
)
)
)
S
PEED
P
P
P
mm/sec .
mm/sec .
mm/sec.
RINT
RINT
RINT
25 - 200
20-150
25-100
C
IPC/J-STD
LASSIFICATION
S
S
S
PEED
PEED
PEED
ROLO
C
C
C
IPC/J-STD
LASSIFICATION
IPC/J-STD
LASSIFICATION
IPC/J-STD
LASSIFICATION
ROMO
ROL0
ORH1
Package size
500 Gram Jar
700 Gram Semco
1300 Gram Semco
30CC EFD Cartridge
750 Gram Proflow
500 Gram Jar
700 Gram Semco
1300 Gram Semco
Package size
500 Gram Jar
700 Gram Semco
1300 Gram Semco