RE900 ROTH ELEKTRONIK, RE900 Datasheet
![SMD To Pin Out Adapter - TSOP Multiple](/photos/24/18/241825/347949306-40_sml.jpg)
RE900
Manufacturer Part Number
RE900
Description
SMD To Pin Out Adapter - TSOP Multiple
Manufacturer
ROTH ELEKTRONIK
Datasheet
1.RE900.pdf
(1 pages)
Specifications of RE900
Board Type
PCB, IC To Pin Out Adapter
Board Material
FR-4
External Height
72.6mm
External Width
76.2mm
Board Thickness
1.5mm
Hole Diameter
1mm
Length/height, External
72.2mm
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Multiadapter - SMD TSOP I/II
RE900
- FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth)
- solder and component side with chemical NI/AU surface and solder stop mask
- pitch spacings: 0.40 mm (15.7 mil); 0.50 mm (19.7 mil); 0.65 mm (26.5 mil);
- hole dia Ø 1.00 mm
- adaption board for 14 different SMD TSOP I and 7 different SMD TSOP II chips
- prescrachted rated break point for the separation of individual moduls from
- Gerber data for manufacture of the soldering paste imprint will be provided free of
- size: 72.60 x 76.20 mm
0.80 mm (30 mil); 1.27 mm (50 mil)
the board
charge on request
Modul-No
RE900-01
RE900-02
RE900-03
RE900-04
RE900-05
RE900-06
Type
TSOP I
TSOP I
TSOP I
TSOP I
TSOP II
TSOP II
Pitch
0.40
0.50
0.50
0.65
0.80
1.27
Pin/Quantity
28,40,48,60
28,32,40,48
20,24
16,24,28,36
40,44
20,24,26,28,32
Size max./mm
12 x 18
12 x 20
6 x 16
12 x 14
11.5 x 18.8
11.5 x 21.3