HFBR-0535 Avago Technologies US Inc., HFBR-0535 Datasheet - Page 5

• Manufacturer Part Number: HFBR-0535
• Description: Fiber Optics, Evaluation Kit
• Manufacturer: Avago Technologies US Inc.

Specifications of HFBR-0535

• Silicon Core Number: HFBR-53D5
• Kit Contents: Evaluation Board, Associated Literature
• Features: Fiber-Optic VCSEL Transceiver, Single Mode Evaluation
• Main Purpose: Interface, Fiber Optics
• Embedded: No
• Utilized Ic / Part: 1x9 Fiber Optic Transceiver Modules
• Primary Attributes: Tests 1x9 Fiber Optic Modules
• Secondary Attributes: SMA Connectors
• Tool / Board Applications: Fiber Optic Transceivers
• Rohs Compliant: Yes
• Operating Voltage: 5 V
• Description/function: Fiber Optic Kit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: HFBR-53D5, HFCT-53D5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

Electromagnetic Interference (EMI)
One of a circuit board designer’s foremost concerns is
the control of electromagnetic emissions from electronic
equipment. Success in controlling generated Electromag-
netic Interference (EMI) enables the designer to pass a
governmental agency’s EMI regulatory standard; and more
importantly, it reduces the possibility of interference to
neighboring equipment. There are three options available
for the HFBR-53D3 and two for the HFCT-53D3 with regard
to EMI shielding which provide the designer with a means
to achieve good EMI performance. The EMI performance
of an enclosure using these transceivers is dependent on
the chassis design. Avago encourages using standard RF
suppression practices and avoiding poorly EMI-sealed
enclosures.
The first configuration is a standard HFBR-53D3 fiber optic
transceiver that has no external EMI shield. This unit is
for applications where EMI is either not an issue for the
designer, the unit resides completely inside a shielded
enclosure, or the module is used in a low density, extremely
quiet application. The HFCT-53D3 is not available for use
without an external shield.
The second configuration, option EM, is for EMI shielding
applications where the position of the transceiver
module will extend outside the equipment enclosure.
The metallized plastic package and integral external
metal shield of the transceiver helps locally to terminate
EM fields to the chassis to prevent their emissions
outside the enclosure. This metal shield contacts the
panel or enclosure on the inside of the aperture on all
but the bottom side of the shield and provides a good
RF connection to the panel. This option can accom-
modate various panel or enclosure thickness, i.e., .04 in.
min. to 0.10 in. max. The reference plane for this panel
thickness variation is from the front surface of the panel
or enclosure. The recommended length for protruding the
HFBR/HFCT-53D3 EM transceiver beyond the front
surface of the panel or enclosure is 0.25 in. With this
option, there is flexibility of positioning the module
to fit the specific need of the enclosure design. (See
Figure 6 for the mechanical drawing dimensions of this
shield.)
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The third configuration, option FM, is for applications that
are designed to have a flush mounting of the module
with respect to the front of the panel or enclosure. The
flush-mount design accommodates a large variety of
panel thickness, i.e., 0.04 in. min. to 0.10 in. max. Note the
reference plane for the flush-mount design is the interior
side of the panel or enclosure. The recommended distance
from the centerline of the transceiver front solder posts to
the inside wall of the panel is 0.55 in. This option contacts
the inside panel or enclosure wall on all four sides of this
metal shield. See Figure 8 for the mechanical drawing
dimensions of this shield.
The two metallized designs are comparable in their
shielding effectiveness. Both design options connect only
to the equipment chassis and not to the signal or logic
ground of the circuit board within the equipment closure.
The front panel aperture dimensions are recommended in
Figures 7 and 9. When layout of the printed circuit board
is done to incorporate these metal-shielded transceivers,
keep the area on the printed circuit board directly under
the metal shield free of any components and circuit board
traces. For additional EMI performance advantage, use
duplex SC fiber-optic connectors that have low metal
content inside them. This lowers the ability of the metal
fiber-optic connectors to couple EMI out through the
aperture of the panel or enclosure.